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1-5120526-1 Datasheet(PDF) 2 Page - Tyco Electronics

Part # 1-5120526-1
Description  Stacking Height Guide for Parallel Board-to-Board Applications
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Manufacturer  MACOM [Tyco Electronics]
Direct Link  http://www.macom.com
Logo MACOM - Tyco Electronics

1-5120526-1 Datasheet(HTML) 2 Page - Tyco Electronics

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83
Catalog 889092
Dimensions are in millimeters
Dimensions are shown for
USA: 1-800-522-6752
South America: 55-11-3611-1514
Revised 9-06
and inches unless otherwise
reference purposes only.
Canada: 1-905-470-4425
Hong Kong: 852-2735-1628
specified. Values in brackets
Specifications subject
Mexico: 01-800-733-8926
Japan: 81-44-844-8013
www.tycoelectronics.com
are standard equivalents.
to change.
C. America: 52-55-5-729-0425
UK: 44-141-810-8967
1.0mm Free Height (FH) (IEEE 1386) Connectors
Fine Pitch SMT Stacking Connectors
(Parallel Board-to-Board)
Product Facts
For board stacking
applications
High density packaging on
1.0 [.039] centerline spacing
Available in standard
64-position and optional
84-position sizes
“Tape-and-reel” packaged
per EIA standards
Board stacking heights
available from 8 [.315] to
15 [.591] (see page 84)
Increased plastic clearance
eliminates stress to solder
joints during mating (see
page 84)
Improved locating posts
ensure accurate hand or
robotic placement (see
page 84)
Meets EIA-700 AAAB
specifications for IEEE 1386
applications
All 1.0mm Free Height
products within this section
are RoHS Compliant
As a standard for adding
local PCI or Sbus perform-
ance to Futurebus+ and
VMEbus applications,
IEEE 1386 offers new levels
of performance and pack-
aging convenience through
the mezzanine architecture.
Tyco Electronics makes it
easier and more productive
to add an IEEE 1386 mez-
zanine connector to your
system. The surface-mount
parallel stacking connector
features contacts on a 1.0
[.039] pitch and is available
in eight stacking heights
from 8 [.315] to 15 [.591].
Sizes include the IEEE 1386
standard 64-position
version and an optional
84-position version.
Not only is the connector
compatible with EIA-700
AAAB — the connector
standard for IEEE 1386
mezzanine connectors —
it offers several enhance-
ments that make it easier to
use and more reliable.
Increased plastic clearance
between mating connectors
makes it easier to align mul-
tiple connectors for mating,
thus eliminating stress to
the solder joints during
engagement. Improved
locating posts allow fast,
highly accurate hand place-
ment of connectors. The
connectors are available
with vacuum covers for
automated placement.
Performance Characteristics
Current Rating —
1.0 ampere per contact
Contact Resistance —
30 milliohms max. (initial)
Durability — tested to 100 mating
cycles min.
Technical Documents (page 113)
Product Specification
108-2246


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