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RLST23A032V Datasheet(PDF) 5 Page - Ruilongyuan Electronics Co.,Ltd |
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RLST23A032V Datasheet(HTML) 5 Page - Ruilongyuan Electronics Co.,Ltd |
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5 / 9 page  TVS/ESD Arrays - RLST23A032-362V Series Circuit Protection System Page:4 Specifications are subject to change without notice. Please refer to http://www.ruilon.com for current information. Applications Information Device Connection Options The RLST23A032V and RLST23A362V series is designed to protect one bidirectional or two unidirectional data or I/O lines operating at 5 to 36 volts. Connection options are as follows: • Bidirectional: Pin 1 is connected to the data line and pin 2 is connected to ground (Since the device is symmetrical, these connections may be reversed). The ground connection should be made directly to a ground plane. The path length should be kept as short as possible to minimize parasitic inductance. Pin 3 is not connected.• Unidirectional: Data lines are connected to pin 1 and pin 2. Pin 3 is connected to ground. For best results, this pin should be connected directly to a ground plane on the board. The path length should be kept as short as possible to minimize parasitic inductance. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of fast rise-time transients such as ESD. The following guidelines are recommended (Refer to application note SI99-01 for more detailed information): • Place the TVS near the input terminals or connectors to restrict transient coupling. • Minimize the path length between the TVS and the protected line. • Minimize all conductive loops including power and ground loops. • The ESD transient return path to ground should be kept as short as possible. • Never run critical signals near board edges. • Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the and pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. Device Schematic & Pin Configuration RS-232 Transceiver Protection Example |
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