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ECDGZE3R9C Datasheet(PDF) 3 Page - Panasonic Semiconductor

Part # ECDGZE3R9C
Description  High-Q Capacitors (Microwave Chip Capacitors)
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Manufacturer  PANASONIC [Panasonic Semiconductor]
Direct Link  http://www.panasonic.com/industrial/
Logo PANASONIC - Panasonic Semiconductor

ECDGZE3R9C Datasheet(HTML) 3 Page - Panasonic Semiconductor

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Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Multilayer Ceramic Capacitors(High-Q Capacitors)
– EC41 –
10
Sample
0.5R
0.3 Size : 0201
0.5 Size : 0402
PC board
20
45
±245±2
Unit : mm
R340
Specifications and Testing Methods
Characteristics
Specifications
Test Method
Operating
Temperature
Range
–55 to 125 °C
———
Dielectric
Withstanding
Voltage
No dielectric breakdown and/or damage
Test voltage: Rated voltage
300 %
Duration: 1 to 5 s
Charge/discharge current: 50 mA max.
Insulation
Resistance (IR)
10000 M
min.
Measuring voltage: Rated voltage
Duration: 60±5 s
Charge / Discharge current: 50 mA max.
Capacitance
Within the specified tolerance
Temperature: 20 +/–2 °C
Measuring Frequency: 1 MHz +/–10 %
Measuring Voltage: 0.5 to 5 Vrms
Dissipation
Factor
(tan
δ)
tan
δ < 0.005 max.
Temperature
Characteristics
C0G : 0 +/-30 ppm/°C
Maximum capacitance change at stage 1 to 5
Stage
Temperature
Stage1
25±2 °C
Stage2
–25±2 °C
Stage3
(Reference Temperature)
25±2 °C
Stage4
85±2 °C
Stage5
25±2 °C
Adhesion
The terminal electrode shall be free from peeling or
signs of peeling.
Applied force :
Size : 0201 : 2N
Size : 0402 : 5N
Arrow direction for 10 seconds.
Bending Strength Appearance : no mechanical damage
Bending value : 1 mm
Bending speed : 1 mm/s
Resistance to
Solder Heat
Appearance : no mechanical damage
I.R. : initial value
Solder temperature : 270±5 °C
Dipping period : 3.0±0.5 s
Preheat condition :
Order
Temp. (°C)
Time (s)
180 to 100
120 to 180
2150 to 200
120 to 180
Recovery (Standard condition)
: 24 ±2 h
Solderability
More than 75 % of the soldered area of both terminal
electrodes shall be covered with fresh solder .
Solder bath method
Solder temperature : 230±5 °C
Dipping period : 4±1 s
Solder : H63A (JIS Z 3283)
✽ Standard condition: Temperature 15 to 35 °C, Relative humidity 45 to 75 %.
00 Sep. 2008


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