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H11G2SM Datasheet(PDF) 2 Page - Fairchild Semiconductor |
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H11G2SM Datasheet(HTML) 2 Page - Fairchild Semiconductor |
2 / 9 page ©2007 Fairchild Semiconductor Corporation www.fairchildsemi.com H11G1M, H11G2M, H11G3M Rev. 1.0.4 2 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Value Units TOTAL DEVICE TSTG Storage Temperature -40 to +150 °C TOPR Operating Temperature -40 to +100 °C TSOL Lead Solder Temperature (Wave Solder) 260 for 10 sec °C PD Total Device Power Dissipation @ TA = 25°C 260 mW Derate Above 25°C 3.5 mW/°C EMITTER IF Forward Input Current 60 mA VR Reverse Input Voltage 6.0 V IF(pk) Forward Current – Peak (1µs pulse, 300pps) 3.0 A PD LED Power Dissipation @ TA = 25°C 100 mW Derate Above 25°C 1.8 mW/°C DETECTOR VCEO Collector-Emitter Voltage V H11G1M 100 H11G2M 80 H11G3M 55 PD Photodetector Power Dissipation @ TA = 25°C 200 mW Derate Above 25°C 2.67 mW/°C |
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