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MXZ9-PW27 Datasheet(PDF) 6 Page - Lumileds Lighting Company |
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MXZ9-PW27 Datasheet(HTML) 6 Page - Lumileds Lighting Company |
6 / 25 page LUXEON 4014 Datasheet DS205 20140223 ©2014 Philips Lumileds Lighting Company. 5 Reflow Soldering Characteristics Table 5. Reflow Profile in Accordance with J-Std-020D. Profile Feature Lead Free Assembly Preheat/Soak : Temperature Min (T smin) Temperature Max (T smax) Maximum Time (t s) from Tsmin to Tsmax 150°C 200°C 120 seconds Ramp-up Rate (T L to Tp ) 3°C / second Liquidous Temperature (T L ) 217°C Maximum Time (t L ) Maintained above TL 150 seconds Maximum Peak Package Body Temperature (T p ) 260°C Time (t p ) within 5°C of the specified temperature (Tc ) 10-30 seconds Maximum Ramp-Down Rate (T p to TL ) 6°C / second Maximum Time 25°C to Peak Temperature 8 minutes Note for Table 5: 1. All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body. 0 50 100 150 200 250 300 050 100 150 200 250 300 Time (seconds) TL: 217°C 255°C +5/-0°C 260°C +0/-5°C ts: 60-120sec. tL: 60-150 sec,max tp: 10-30sec. 30sec max. Tsmin: 150°C Ramp-Up Rate, 3°C/sec. max. Tsmax:200°C Tp: 260°C Temperature Profile for Table 5. |
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