LUXEON Rebel PLUS Datasheet DS107 20140122 ©2014 Philips Lumileds Lighting Company.

5

Reflow Soldering Characteristics

Table 6.

Profile Feature

Lead Free Assembly

Average Ramp-Up Rate ( Ts

3°C / second max

Preheat Temperature Min ( Ts

150°C

Preheat Temperature Max ( Ts

200°C

Preheat Time (ts

60 - 180 seconds

Temperature ( T

217°C

Time Maintained Above Temperature T

L

60 - 150 seconds

Peak / Classification Temperature ( T

260°C

Time Within 5°C of Actual Peak Temperature (t

20 - 40 seconds

Ramp-Down Rate

6°C / second max

Time 25°C to Peak Temperature

8 minutes max

Note for Table 6:

1. All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body.

Figure 1. Temperature Profile for Table 6.