LUXEON 3030 2D Datasheet DS207 20140318 ©2014 Philips Lumileds Lighting Company.

5

Reflow Soldering Characteristics

Table 5.

Profile Feature

Lead Free Assembly

Preheat/Soak:

Temperature Min ( T

Temperature Max ( Ts

Maximum Time (ts) from Ts

150°C

200°C

120 seconds

Ramp-Up Rate ( T

3°C / second

Liquidous Temperature (T

217°C

Maximum Time ( t

150 seconds

Maximum Peak Package Body Temperature ( T

260°C

Time ( t

10 - 30 seconds

Maximum Ramp-Down Rate ( T

6°C / second

Maximum Time 25°C to Peak Temperature

8 minutes

Note for Table 5:

1. All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body.

Figure 1. Temperature Profile for Table 5.