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prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.

Copyright © 2011 GlobalTop Technology Inc. All Rights Reserved.

FGPMMOPA6B Data Sheet

GlobalTop Technology

Rev. A07

Table of Contents

1. Functional Description ........................................................................................................... 4

1.1 Overview .......................................................................................................................4

1.2 Highlights and Features ................................................................................................4

1.3 System Block Diagram...................................................................................................5

2. Specifications ........................................................................................................................ 6

2.1 Mechanical Dimension .................................................................................................6

2.2 Recommended PCB pad Layout....................................................................................8

2.3 Pin Configuration ........................................................................................................10

2.4 Pin Assignment ...........................................................................................................10

2.5 Description of I/O Pin .................................................................................................11

2.6 Specification List .........................................................................................................13

2.7 DC Characteristics .......................................................................................................15

3. Protocols ..............................................................................................................................16

3.1 NMEA Output Sentences ............................................................................................16

3.2 MTK NMEA Command Protocols................................................................................21

3.3 Firmware Customization Services...............................................................................22

4. Reference Design ..................................................................................................................23

4.1 Reference Design Circuit.............................................................................................23

5. Packing and Handling............................................................................................................24

5.1 Moisture Sensitivity ....................................................................................................24

5.2 Packing ........................................................................................................................25

5.3 Storage and Floor Life Guideline.................................................................................27

5.4 Drying..........................................................................................................................27

5.5 ESD Handling...............................................................................................................28

6. Reflow Soldering Temperature Profile ...................................................................................29

6.1 SMT Reflow Soldering Temperature Profile................................................................29

6.2 Cautions on Reflow Soldering with Patch Antenna ....................................................30

6.3 Manual Soldering........................................................................................................33

7. Contact Information..............................................................................................................33