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FGPMMOPA6B Datasheet(PDF) 3 Page - List of Unclassifed Manufacturers |
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FGPMMOPA6B Datasheet(HTML) 3 Page - List of Unclassifed Manufacturers |
3 / 33 page 3 3 This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2011 GlobalTop Technology Inc. All Rights Reserved. FGPMMOPA6B Data Sheet GlobalTop Technology Rev. A07 Table of Contents 1. Functional Description ........................................................................................................... 4 1.1 Overview .......................................................................................................................4 1.2 Highlights and Features ................................................................................................4 1.3 System Block Diagram...................................................................................................5 2. Specifications ........................................................................................................................ 6 2.1 Mechanical Dimension .................................................................................................6 2.2 Recommended PCB pad Layout....................................................................................8 2.3 Pin Configuration ........................................................................................................10 2.4 Pin Assignment ...........................................................................................................10 2.5 Description of I/O Pin .................................................................................................11 2.6 Specification List .........................................................................................................13 2.7 DC Characteristics .......................................................................................................15 3. Protocols ..............................................................................................................................16 3.1 NMEA Output Sentences ............................................................................................16 3.2 MTK NMEA Command Protocols................................................................................21 3.3 Firmware Customization Services...............................................................................22 4. Reference Design ..................................................................................................................23 4.1 Reference Design Circuit.............................................................................................23 5. Packing and Handling............................................................................................................24 5.1 Moisture Sensitivity ....................................................................................................24 5.2 Packing ........................................................................................................................25 5.3 Storage and Floor Life Guideline.................................................................................27 5.4 Drying..........................................................................................................................27 5.5 ESD Handling...............................................................................................................28 6. Reflow Soldering Temperature Profile ...................................................................................29 6.1 SMT Reflow Soldering Temperature Profile................................................................29 6.2 Cautions on Reflow Soldering with Patch Antenna ....................................................30 6.3 Manual Soldering........................................................................................................33 7. Contact Information..............................................................................................................33 |
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