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SLN04G72G2BF2HY-CCRT Datasheet(PDF) 2 Page - List of Unclassifed Manufacturers |
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2 / 17 page preliminary Data Sheet Rev.0.9 26.07.2013 Swissbit AG Industriestrasse 4 Fon: +41 (0) 71 913 03 03 www.swissbit.com Page 2 CH – 9552 Bronschhofen Fax: +41 (0) 71 913 03 15 eMail: info@swissbit.com of 17 This Swissbit module is an industry standard 204-pin 8-byte DDR3 SDRAM ECC Small Outline Dual-In-line Memory Module (SO-UDIMM) which is organized as x72 high speed CMOS memory arrays. The module uses internally configured octal-bank DDR3 SDRAM devices. The module uses double data rate architecture to achieve high-speed operation. DDR3 SDRAM modules operate from a differential clock (CK and CK#). READ and WRITE accesses to a DDR3 SDRAM module is burst-oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. The burst length is either four or eight locations. An auto precharge function can be enabled to provide a self-timed row precharge that is initiated at the end of a burst access. The DDR3 SDRAM devices have a multibank architecture which allows a concurrent operation that is providing a high effective bandwidth. A self refresh mode is provided and a power- saving “power- down” mode. All inputs and all full drive-strength outputs are SSTL_15 compatible. The DDR3 SDRAM module uses the serial presence detect (SPD) function implemented via serial EEPROM using the standard I 2C protocol. This nonvolatile storage device contains 256 bytes. The first 128 bytes are utilized by the SO-U DIMM manufacturer (Swissbit) to identify the module type, the module’s organization and several timing parameters. The second 128 bytes are available to the end user. Module Configuration Organization DDR3 SDRAMs used Row Addr. Device Bank Addr. Column Addr. Refresh Module Bank Select 512M x 72bit 18 x 256M x 8bit (2Gbit) 15 BA0, BA1, BA2 10 8k S0#, S1# Module Dimensions in mm 67.60 (long) x 30(high) x 3.80 [max] (thickness) Timing Parameters Part Number Module Density Transfer Rate Clock Cycle/Data bit rate Latency SLN04G72G2BF2HY-CCRT 4GByte 10.6 GB/s 1.5ns/1333MT/s 9-9-9 SLN04G72G2BF2HY-DCRT 4GByte 12.8 GB/s 1.25ns/1600MT/s 11-11-11 Pin Name A0 – A9, A11 – A14 Address Inputs A10/AP Address Input / Autoprecharge Bit BA0 – BA2 Bank Address Inputs DQ0 – DQ63 Data Input / Output CB0 – CB07 ECC check bits DM0 – DM8 Input Data Mask DQS0 – DQS8 Data Strobe, positive line DQS0# – DQS8# Data Strobe, negative line (only used when differential data strobe mode is enabled) RAS# Row Address Strobe CAS# Column Address Strobe WE# Write Enable CKE0 – CKE1 Clock Enable S0#, S1# Chip Select CK0 – CK1 Clock Inputs, positive line CK0# – CK1# Clock Inputs, negative line Figure 1: Mechanical Dimensions |
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