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THS4631 Datasheet(PDF) 3 Page - National Semiconductor (TI) |
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THS4631 Datasheet(HTML) 3 Page - National Semiconductor (TI) |
3 / 34 page 1 2 3 4 8 7 6 5 NC VIN− VIN+ VS− NC VS+ VOUT− NC NC = No Internal Connection TOP VIEW D, DDA, AND DGN THS4631 www.ti.com SLOS451B – DECEMBER 2004 – REVISED AUGUST 2011 PACKAGE / ORDERING INFORMATION PACKAGE DEVICES(1) PACKAGE TYPE SOIC – 8 TRANSPORT MEDIA, QUANTITY THS4631D Rails, 75 SOIC – 8 THS4631DR Tape and Reel, 2500 THS4631DDA Rails, 75 SOIC-PP – 8(2) THS4631DDAR Tape and Reel, 2500 THS4631DGN Rails, 100 MSOP-PP – 8(2) THS4631DGNR Tape and Reel, 2500 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. (2) PowerPad ™ is electrically isolated from all other pins. Connection of the PowerPAD to the PCB ground plane is recommended because the ground plane is typically the largest copper area on a PCB. However, connection of the PowerPAD to VS- up to VS+ is allowed if desired. PIN ASSIGNMENTS THS4631 Copyright © 2004–2011, Texas Instruments Incorporated 3 |
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