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OPA2822E-2K5 Datasheet(PDF) 2 Page - Texas Instruments |
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OPA2822E-2K5 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 33 page OPA2822 2 SBOS188E www.ti.com Supply Voltage ................................................................................. ±6.5V Internal Power Dissipation ........................... See Thermal Characteristics Differential Input Voltage .................................................................. ±1.2V Input Voltage Range ............................................................................ ±V S Storage Temperature Range ......................................... –65 °C to +125°C Lead Temperature (SO-8) ............................................................. +260 °C Junction Temperature (TJ ) ........................................................... +150°C ESD Rating (Human Body Model) .................................................. 2000V (Machine Model) ........................................................... 200V NOTE: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. ABSOLUTE MAXIMUM RATINGS(1) PACKAGE/ORDERING INFORMATION(1) SPECIFIED PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING NUMBER MEDIA, QUANTITY OPA2822U SO-8 Surface-Mount D –40 °C to +85°C OPA2822U OPA2822U Rails, 100 "" " " " OPA2822U/2K5 Tape and Reel, 2500 OPA2822E MSOP-8 Surface-Mount DGK –40 °C to +85°C D22 OPA2822E/250 Tape and Reel, 250 "" " " " OPA2822E/2K5 Tape and Reel, 2500 NOTE: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet. ELECTROSTATIC DISCHARGE SENSITIVITY Electrostatic discharge can cause damage ranging from per- formance degradation to complete device failure. Texas In- struments recommends that all integrated circuits be handled and stored using appropriate ESD protection methods. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet published speci- fications. Top View SO PIN CONFIGURATION / MSOP PACKING MARKING MSOP PACKAGE MARKING 1 2 3 4 8 7 6 5 +V S Out B –In B +In B Out A –In A +In A –V S OPA2822 D22 8 765 1 234 |
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