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THS4051 Datasheet(PDF) 2 Page - National Semiconductor (TI) |
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THS4051 Datasheet(HTML) 2 Page - National Semiconductor (TI) |
2 / 36 page THS4051 THS4052 SLOS238D − MAY 1999 − REVISED AUGUST 2008 www.ti.com 2 CAUTION: The THS4051 and THS4052 provide ESD protection circuitry. However, permanent damage can still occur if this device is subjected to high-energy electrostatic discharges. Proper ESD precautions are recommended to avoid any performance degradation or loss of functionality. ABSOLUTE MAXIMUM RATINGS OVER OPERATING FREE-AIR TEMPERATURE (UNLESS OTHERWISE NOTED)(1) Supply voltage, VCC ±16.5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input voltage, VI ±VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output current, IO 150 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Differential input voltage, VIO ±4 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous total power dissipation See Dissipation Rating Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Maximum junction temperature, TJ 150 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating free-air temperature, TA: C-suffix 0 °C to 70°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I-suffix −40 °C to 85°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . M-suffix −55 °C to 125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature, Tstg −65 °C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds, JG package 300 °C . . . . . . . . . . . . . . . . . . . Case temperature for 60 seconds, FK package 260 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATING TABLE PACKAGE θJA θJC TA = 25°C PACKAGE θJA ( °C/W) θJC ( °C/W) TA = 25 C POWER RATING D 167‡ 38.3 740 mW DGN§ 58.4 4.7 2.14 W JG 119 28 1050 mW FK 87.7 20 1375 mW ‡ This data was taken using the JEDEC standard Low-K test PCB. For the JEDEC Proposed High-K test PCB, the θJA is 95°C/W with a power rating at TA = 25°C of 1.32 W. § This data was taken using 2 oz. trace and copper pad that is soldered directly to a 3 in. × 3 in. PC. For further information, refer to Application Information section of this data sheet. RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT Supply voltage, VCC+ and VCC− Dual supply ±4.5 ±16 V Supply voltage, VCC+ and VCC− Single supply 9 32 V C-suffix 0 70 Operating free-air temperature, TA I-suffix −40 85 °C Operating free-air temperature, TA M-suffix −55 125 C |
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