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OPA2835 Datasheet(PDF) 2 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
Part # OPA2835
Description  Ultra Low-Power, Rail-to-Rail Out, Negative Rail In, VFB Op Amp
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

OPA2835 Datasheet(HTML) 2 Page - National Semiconductor (TI)

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OPA835
OPA2835
SLOS713E – JANUARY 2011 – REVISED JULY 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGING/ORDERING INFORMATION(1)
CHANNEL
PACKAGE –
PACKAGE
PRODUCT
COUNT
LEAD
DESIGNATOR
OPA835
1
SOT23-6
DBV
1
WQFN-10
RUN
OPA2835
2
SOIC-8
D
2
VSSOP-10
DGS
2
WQFN-10
RUN
2
UQFN-10
RMC
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
UNITS
VS– to VS+
Supply voltage
5.5
VI
Input voltage
VS– - 0.7V to VS+ + 0.7V
VID
Differential input voltage
1 V
II
Continuous input current
0.85 mA
IO
Continuous output current
60 mA
Continuous power dissipation
See Thermal Characteristics Specification
TJ
Maximum junction temperature
150°C
TA
Operating free-air temperature range
–40°C to 125°C
Tstg
Storage temperature range
–65°C to 150°C
HBM
6 kV
ESD ratings
CDM
1 kV
MM
200 V
THERMAL INFORMATION
OPA835
OPA2835
VSSOP
THERMAL METRIC(1)
SOT23-6
WQFN-10
SOT23-6
(MSOP) - 10
WQFN-10
UQFN-10
UNITS
(DBV)
(RUN)
(D)
(DGS)
(RUN)
(RMC)
6 PINS
10 PINS
8 PINS
10 PINS
10 PINS
10 PINS
θJA
Junction-to-ambient thermal resistance
194
145.8
150.1
206
145.8
143.2
θJCtop
Junction-to-case (top) thermal resistance
129.2
75.1
83.8
75.3
75.1
49.0
θJB
Junction-to-board thermal resistance
39.4
38.9
68.4
96.2
38.9
61.9
°C/W
ψJT
Junction-to-top characterization parameter
25.6
13.5
33.0
12.9
13.5
3.3
ψJB
Junction-to-board characterization parameter
38.9
104.5
67.9
94.6
104.5
61.9
θJCbot
Junction-to-case (bottom) thermal resistance
n/a
n/a
n/a
n/a
n/a
n/a
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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Copyright © 2011–2013, Texas Instruments Incorporated
Product Folder Links: OPA835 OPA2835


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