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RX64M Datasheet(PDF) 1 Page - Renesas Technology Corp

Part # RX64M
Description  MCUs
Download  67 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

RX64M Datasheet(HTML) 1 Page - Renesas Technology Corp

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RX64M Group
Renesas MCUs
Preliminary Datasheet
Specifications in this document are tentative and subject to change.
R01DS0173EJ0090 Rev.0.90
Page 1 of 67
Feb 28, 2014
Features
■ 32-bit RXv2 CPU core
 Max. operating frequency: 120 MHz
Capable of 240 DMIPS in operation at 120 MHz
 Single precision 32-bit IEEE-754 floating point
 Two types of multiply-and-accumulation unit (between memories
and between registers)
 32-bit multiplier (fastest instruction execution takes one CPU clock
cycle)
 Divider (fastest instruction execution takes two CPU clock cycles)
 Fast interrupt
 CISC Harvard architecture with 5-stage pipeline
 Variable-length instructions: Ultra-compact code
 Supports the memory protection unit (MPU)
 JTAG and FINE (two-line) debugging interfaces
■ Low-power design and architecture
 Operation from a single 2.7- to 3.6-V supply
 Low power consumption: A product that supports all peripheral
functions draws only 0.3mA/MHz (Typ.).
 RTC is capable of operation from a dedicated power supply.
 Four low-power modes
■ On-chip code flash memory, no wait states
 Supports versions with up to 4 Mbytes of ROM
 120-MHz operation, 8.3-ns read cycle (no wait states)
 User code is programmable by on-board or off-board programming.
 Programming/erasing as background operations (BGOs)
■ On-chip data flash memory
 Max. 64 Kbytes, reprogrammable up to 100,000 times
 Programming/erasing as background operations (BGOs)
■ On-chip SRAM
 512 Kbytes of SRAM (no wait states)
 32 Kbytes of RAM with ECC (one wait state, single-error correction
and double error detection)
 8 Kbytes of standby RAM (backup on deep software standby)
■ Data transfer
 DMAC: 8 channels
 DTC
 EXDMAC: 2 channels
 DMAC for the Ethernet controller: 2 channels for 176- and 177-pin
products; 1 channel for 100-, 144-, and 145-pin products
■ Reset and supply management
 Power-on reset (POR)
 Low voltage detection (LVD) with voltage settings
■ Clock functions
 External crystal oscillator or internal PLL for operation at 8 to 24
MHz
 Internal 240-kHz LOCO and HOCO selectable from 16, 18, and 20
MHz
 120-kHz clock for the IWDTa
■ Real-time clock
 Adjustment functions (30 seconds, leap year, and error)
 Real-time clock counting and binary counting modes are selectable
 Time capture function
(for capturing times in response to event-signal input)
■ Independent watchdog timer
 120-kHz (1/2 LOCO frequency) clock operation
■ Useful functions for IEC60730 compliance
 Oscillation-stoppage detection, frequency measurement, CRC,
IWDTa, self-diagnostic function for the A/D converter, etc.
 Register write protection function can protect values in important
registers against overwriting.
■ Various communications interfaces
 Ethernet MAC (for 176- and 177-pin products: 2 modules)
 PHY layer for host/function or OTG controller (1) with full-speed
USB 2.0 with battery charging transfer (only for 176- and 177-pin
products)
 PHY layer (1) for host/function or OTG controller (1) with full-
speed USB 2.0 transfer
 CAN (compliant with ISO11898-1), incorporating 32 mailboxes (up
to 3 modules)
 SCIg and SCIh with multiple functionalities (up to 9)
Choose from among asynchronous mode, clock-synchronous mode,
smart-card interface mode, simplified SPI, simplified I2C, and
extended serial mode.
 SCIFA with 16-byte transmission and reception FIFOs (up to 4
interfaces)
 I2C bus interface for transfer at at up to 1 Mbps (up to 2 interfaces)
 Four-wire QSPI (1 interface) in addition to RSPIa (1 interface)
 Parallel data capture unit (PDC) for the CMOS camera interface (not
in 100-pin products)
 SD host interface (optional: 1 interface) with a 1- or 4-bit SD bus for
use with SD memory or SDIO
■ External address space
 Buses for full-speed data transfer (max. operating frequency of 60
MHz)
 8 CS areas
 8-, 16-, or 32-bit bus space is selectable per area
 Independent SDRAM area (128 Mbytes)
■ Up to 29 extended-function timers
 16-bit TPUa, MTU3a, and GPTA: input capture, output compare,
PWM waveform output
 8-bit TMRa (4 channels), 16-bit CMT (4 channels), 32-bit CMTW (2
channels)
■ 12-bit A/D converter
 Two 12-bit units (8 channels for unit 0; 21 channels for unit 1)
 Self diagnosis
 Detection of analog input disconnection
■ 12-bit D/A converter: 2 channels
 On-chip operational amplifier output or direct input selectable
■ Temperature sensor for measuring temperature
within the chip
■ Encryption (optional)
 AES (key lengths: 128, 196, and 256 bits)
 DES (key lengths: 56 bits (DES); 3 × 56 bits (T-DES))
 SHA (SHA-1 (128), SHA-2 (224 or 256), HMAC (160, 224, or 256))
■ Up to 127 pins for general I/O ports
 5-V tolerance, open drain, input pull-up, switchable driving ability
■ Operating temp. range
 –40C to +85C
PLQP0176KB-A 24 × 24 mm, 0.5-mm pitch
PLQP0144KA-A 20 × 20 mm, 0.5-mm pitch
PLQP0100KB-A 14 × 14 mm, 0.5-mm pitch
PTLG0177KA-A 8 × 8 mm, 0.5-mm pitch
PTLG0145KA-A 7 × 7 mm, 0.5-mm pitch
PTLG0100JA-A 7 × 7 mm, 0.65-mm pitch
PLBG0176GA-A 13 × 13mm, 0.8-mm pitch
120-MHz 32-bit RX MCU, on-chip FPU, 240 DMIPS, up to 4-MB flash memory,
512-KB SRAM, various communications interfaces including IEEE 1588-compliant Ethernet MAC,
full-speed USB 2.0 with battery charging, SD host interface (optional), quad SPI, and CAN, 12-bit A/D
converter, RTC, encryption (optional), serial interface for audio, CMOS camera interface
R01DS0173EJ0090
Rev.0.90
Feb 28, 2014
Features


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