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L0805220CGWTR Datasheet(PDF) 5 Page - AVX Corporation |
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L0805220CGWTR Datasheet(HTML) 5 Page - AVX Corporation |
5 / 5 page 32 2 32 Accu-L ® 0805 Application Notes HANDLING SMD chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pick-ups is strongly recommended for individual components. Bulk handling should ensure that abrasion and mechanical shock are min- imized. For automatic equipment, taped and reeled product is the ideal medium for direct presentation to the placement machine. CIRCUIT BOARD TYPE All flexible types of circuit boards may be used (e.g. FR-4, G-10) and also alumina. For other circuit board materials, please consult factory. COMPONENT PAD DESIGN Component pads must be designed to achieve good joints and minimize component movement during soldering. Pad designs are given below for both wave and reflow soldering. The basis of these designs is: a. Pad width equal to component width. It is permissible to decrease this to as low as 85% of component width but it is not advisable to go below this. b. Pad overlap about 0.3mm. c. Pad extension about 0.3mm for reflow. Pad extension about 0.8mm for wave soldering. PREHEAT & SOLDERING The rate of preheat in production should not exceed 4°C/second. It is recommended not to exceed 2°C/ second. Temperature differential from preheat to soldering should not exceed 150°C. For further specific application or process advice, please consult AVX. HAND SOLDERING & REWORK Hand soldering is permissible. Preheat of the PCB to 100°C is required. The most preferable technique is to use hot air soldering tools. Where a soldering iron is used, a tempera- ture controlled model not exceeding 30 watts should be used and set to not more than 260°C. Maximum allowed time at temperature is 1 minute. When hand soldering, the base side (white side) must be soldered to the board. COOLING After soldering, the assembly should preferably be allowed to cool naturally. In the event of assisted cooling, similar condi- tions to those recommended for preheating should be used. CLEANING RECOMMENDATIONS Care should be taken to ensure that the devices are thor- oughly cleaned of flux residues, especially the space beneath the device. Such residues may otherwise become conduc- tive and effectively offer a lossy bypass to the device. Various recommended cleaning conditions (which must be optimized for the flux system being used) are as follows: Cleaning liquids . . . . . . i-propanol, ethanol, acetylace- tone, water, and other standard PCB cleaning liquids. Ultrasonic conditions . . power – 20w/liter max. frequency – 20kHz to 45kHz. Temperature . . . . . . . . . 80°C maximum (if not otherwise limited by chosen solvent system). Time. . . . . . . . . . . . . . . 5 minutes max. STORAGE CONDITIONS Recommended storage conditions for Accu-L ® prior to use are as follows: Temperature. . . . . . . . . 15°C to 35°C Humidity . . . . . . . . . . . ≤65% Air Pressure . . . . . . . . . 860mbar to 1060mbar RECOMMENDED SOLDERING PROFILE For recommended soldering profile see page 23 REFLOW SOLDERING DIMENSIONS: millimeters (inches) WAVE SOLDERING DIMENSIONS: millimeters (inches) 1.2 (0.047) 1.2 (0.047) 1.4 (0.055) 3.8 (0.150) 1.5 (0.059) 0805 Accu-L ® 0.7 (0.028) 0.7 (0.028) 1.4 (0.055) 2.8 (0.110) 1.5 (0.059) 0805 Accu-L ® 1.30 (0.051) 1.30 (0.051) 0.50 (0.020) 3.1 (0.122) 0.8 (0.031) 0603 Accu-L ® 0.90 (0.035) 0.90 (0.035) 0.50 (0.020) 2.3 (0.091) 0.8 (0.031) 0603 Accu-L ® |
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