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HB01U12D12 Datasheet(PDF) 3 Page - C&D Technologies |
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HB01U12D12 Datasheet(HTML) 3 Page - C&D Technologies |
3 / 4 page HB01U 11/98 REV B Page 3 MECHANICAL Package/Pinout "Y" and "Z" 0.100±0.010" (2.54±0.25) 0.020±0.002" (0.51±0.05) 0.015±0.005" (0.38±0.13) 0.375±0.005" (9.52±0.13) 1.285±0.010" (32.64±0.25) 24 23 22 15 14 13 12 11 10 3 2 1 0.014±0.002" (0.36±0.05) .015±.010" (.38±.25) 0.525±0.010" (13.34±0.25) 0.695±0.015" (17.65±0.38) 0°- 15° 0.125+0.030" -0.000" (3.18+0.76) ( -0.00) 0.600" (15.24) 0.100±0.010" (2.54±0.25) 0.020±0.002" (0.51±0.05) 0.015±0.005" (0.38±0.13) 0.375±0.005" (9.52±0.13) 1.285±0.010" (32.64±0.25) 24 23 22 15 14 13 12 11 10 3 2 1 0.525±0.010" (13.34±0.25) SIDE VIEWS TOP VIEWS END VIEWS SMD PACKAGE DIP PACKAGE HB01UxxyzzY HB01UxxyzzZ NU = Do Not Use. NC = No Internal Connection. Duplicate pin functions are internally connected. All dimensions are in inches (millimeters). GRID: 0.100 inches (2.54 millimeters) Typically Marked with: specific model ordered, date code, job code and Logo. PIN CONNECTIONS PIN# SINGLES DUALS 1+VOUT +VOUT 2-VOUT Common 3NU -VOUT 10 -VIN -VIN 11 NC NC 12 +VIN +VIN 13 +VIN +VIN 14 NC NC 15 -VIN -VIN 21 NC NC 22 NU -VOUT 23 -VOUT Common 24 +VOUT +VOUT RECOMMENDED LAND PATTERN 24 23 22 15 14 13 12 11 10 3 2 1 0.730" (18.54) 1.150" (29.21) 0.100" (2.54) 0.080" (2.03) 0.040" (1.02) 50 100 150 200 250 TIME (seconds) 235 °C MAX 220 190 30 sec MAX (>220°C) 90 sec MAX (>190°C) RECOMMENDED REFLOW PROFILE MATERIAL: Units are encapsulated in a low thermal resistance molding compound which has excellent chemical resistance, wide operating temperature range, and good electrical properties under high humidity environments. The encapsulant and outer shell of the unit have UL94V-0 ratings. Lead material is brass with a solder plated surface to allow ease of solderability. |
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