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IR21141SS Datasheet(PDF) 2 Page - International Rectifier |
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IR21141SS Datasheet(HTML) 2 Page - International Rectifier |
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2 / 34 page  IR21141/IR22141SSPbF www.irf.com © 2009 International Rectifier 2 Recommended Operating Conditions For proper operation the device should be used within the recommended conditions. All voltage parameters are absolute voltages referenced to VSS. The VS offset rating is tested with all supplies biased at a 15 V differential. Symbol Definition Min. Max. Units VB High side floating supply voltage † VS + 11.5 VS + 20 IR21141 VSS 600 VS High side floating supply offset voltage †† IR22141 VSS 1200 VHO High side output voltage (HOP, HON and SSDH) VS VS + 20 VLO Low side output voltage (LOP, LON and SSDL) VCOM VCC VCC Low side and logic fixed supply voltage (Note 1) 11.5 20 COM Power ground -5 5 VIN Logic input voltage (HIN, LIN and FLT_CLR) VSS VCC VFLT Fault input/output voltage (FAULT/SD and SY_FLT) VSS VCC VDSH High side DS pin input voltage VS - 2.0 VB VDSL Low side DS pin input voltage VCOM - 2.0 VCC V tPWHIN High side pulse width for HIN input 1 µs TA Ambient temperature -40 125 °C † While internal circuitry is operational below the indicated supply voltages, the UV lockout disables the output drivers if the UV thresholds are not reached. A minimum supply voltage of 8V is recommended for the driver to operate safely under switching conditions at VS pin (please refer to the “start-up sequence” in application section of this document) †† Logic operational for VS from VSS-5 V to VSS +600 V or 1200 V. Logic state held for VS from VSS -5 V to VSS- VBS. For a negative spike on VB (referenced to VSS) of less than 200ns the IC will withstand a sustained peak of -40V under normal operation and an isolated event of up to -70V peak spike (please refer to the Design Tip DT97-3 for more details). Absolute Maximum Ratings Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to VSS, all currents are defined positive into any lead The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Symbol Definition Min. Max. Units VS High side offset voltage VB - 25 VB + 0.3 IR21141 -0.3 625 VB High side floating supply voltage IR22141 -0.3 1225 VHO High side floating output voltage (HOP, HON and SSDH) VS - 0.3 VB + 0.3 VCC Low side and logic fixed supply voltage -0.3 25 COM Power ground VCC - 25 VCC + 0.3 VLO Low side output voltage (LOP, LON and SSDL) VCOM -0.3 VCC + 0.3 VIN Logic input voltage (HIN, LIN and FLT_CLR) -0.3 VCC + 0.3 VFLT Fault input/output voltage (FAULT/SD and SY_FLT) -0.3 VCC + 0.3 VDSH High side DS input voltage VS -3 VB + 0.3 VDSL Low side DS input voltage VCOM -3 VCC + 0.3 V dVs/dt Allowable offset voltage slew rate — 50 V/ns PD Package power dissipation @ TA ≤ 25 °C — 1.5 W RthJA Thermal resistance, junction to ambient — 65 °C/W TJ Junction temperature — 150 TS Storage temperature -55 150 TL Lead temperature (soldering, 10 seconds) — 300 °C |
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