06/26/12

www.irf.com

1

AUTOMOTIVE GRADE

PD - 97793

Description

Specifically designed for Automotive applications,

processing techniques to achieve extremely low

on-resistance per silicon area. Additional features

of this design are a 175°C junction operating

temperature, fast switching speed and improved

repetitive avalanche rating . These features com-

bine to make this design an extremely efficient

and reliable device for use in Automotive applica-

tions and a wide variety of other applications.

AUXFS4409

*Qualification standards can be found at http://www.irf.com/

Features

●

Advanced Process Technology

●

Low On-Resistance

●

175°C Operating Temperature

●

Fast Switching

●

Repetitive Avalanche Allowed up to Tjmax

●

Lead-Free, RoHS Compliant

●

Automotive Qualified *

300V

58m



max.

75m



39A

S

D

G

G

D

S

Gate

Drain

Source

AUXFS4409

S

D

G

D

Parameter

Units

A

Pulsed Drain Current

™

W

Linear Derating Factor

W/°C

Gate-to-Source Voltage

V

Single Pulse Avalanche Energy (Thermally Limited)

d

mJ

Single Pulse Avalanche Energy Tested Value

h

Avalanche Current

Ù

A

Repetitive Avalanche Energy

g

mJ

Operating Junction and

Storage Temperature Range

°C

Soldering Temperature, for 10 seconds (1.6mm from case )

Thermal Resistance

Parameter

Typ.

Max.

Units

Junction-to-Case

j

–––

0.40

°C/W

Junction-to-Ambient (PCB Mount)

i

–––

40

690

550

See Fig.12a, 12b, 15, 16

375

2.5

± 20

Max.

39

28

180

-55 to + 175

300

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These

are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in

the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.