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CSPST08-330F Datasheet(PDF) 1 Page - California Micro Devices Corp |
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CSPST08-330F Datasheet(HTML) 1 Page - California Micro Devices Corp |
1 / 4 page © 2000 California Micro Devices Corp. All rights reserved. 11/10/2000 1 CSPST CALIFORNIA MICRO DEVICES 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com Chip Scale Series Termination Array Features • 8 or 16 integrated high frequency series terminations • Ultra small footprint Chip Scale Package • Ceramic substrate • 0.35mm Eutectic Solder Bumps, 0.65mm pitch Product Description The CSPST is a high performance Integrated Passive Device (IPD) which provides series terminations suitable for use in high speed bus applications. Eight (8) or sixteen (16) series termination versions are provided. These resistors provide excellent high frequency performance in excess of 3GHz and are manufactured to an absolute tolerance as low as ±1%. The Chip Scale Applications • Series resistive bus termination • Isolated resistor array C1300700 SCHEMATIC DIAGRAMS Package provides an ultra small footprint for this IPD and provides minimal parasitics compared to conven- tional packaging. Typical bump inductance is less than 25pH. The large solder bumps and ceramic substrate allow for standard attachment to laminate printed circuit boards without the use of underfill. CSPST08 R1 R1 D C B A 12 3 4 R1 R1 R1 R1 R1 R1 R1 R1 D C B A 12 3 4 R1 R1 R1 R1 R1 R1 5 R1 R1 6 R1 R1 7 R1 R1 8 R1 R1 CSPST16 S E U L A V D R A D N A T S e u l a V r o t s i s e R2 2 = 1 R , Ω 3 3 , Ω 9 3 , Ω 7 4 , Ω 1 5 , Ω 6 5 , Ω R e c n a r e l o T e t u l o s b A% 5 ± , % 1 ± s r o t s i s e R f o R C Tm p p 0 0 1 ± r o t s i s e R / g n i t a R r e w o PW m 0 0 1 e g n a R e r u t a r e p m e T g n i t a r e p OC ° 5 8 o t C ° 0 4 – |
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