GE

Data Sheet

KSTW002A5B Barracuda* Series; DC-DC Converter Power Modules

36-75Vdc Input; 12Vdc, 2.5A Output

September 26, 2013

©2013 General Electric Corporation. All rights reserved.

Page 8





































k

V

R

set

o

up

adj

22

.

10

%

511

%

225

.

1

%)

100

(

11

.

5

,

Where

100

%

,

,

,

























set

o

set

o

desired

o

V

V

V

Figure 12. Circuit Configuration to Increase Output Voltage.

The combination of the output voltage adjustment and the

output voltage initial tolerance must not exceed the allowable

trim range of 80% to 110% of the nominal output voltage as

measured between the Vout+ and Vout- pins.

The KSTW002A5B power modules have a fixed current-limit set

point. Therefore, as the output voltage is adjusted down, the

available output power shall be reduced.

Pre-bias Vin Under Voltage Test

The module shall recover from UVLO [Under Voltage Lock Out]

without protective shutdown from OCP or OVP or hard failure,

when subjected to Vin Under Voltage transients with the

following conditions:

Vin(V)

Tdip (ms)

Co (uF)

Load (A)

48

5

0

0

48

5

2200

0

48

10

0

0

48

10

2200

0

48

5

0

2.5

48

5

2200

2.5

48

10

0

2.5

48

10

2200

2.5

60

5

0

0

60

5

2200

0

60

10

0

0

60

10

2200

0

60

5

0

2.5

60

5

2200

2.5

60

10

0

2.5

60

10

2200

2.5

Thermal Considerations

The power modules operate in a variety of thermal

environments; however, sufficient cooling should be provided

to help ensure reliable operation.

Considerations include ambient temperature, airflow, module

power dissipation, and the need for increased reliability. A

reduction in the operating temperature of the module will

result in an increase in reliability.

The thermal data presented here is based on physical

measurements taken in a wind tunnel, using automated

thermo-couple instrumentation to monitor key component

temperatures: FETs, diodes, control ICs, magnetic cores,

ceramic capacitors, opto-isolators, and module pwb

conductors, while controlling the ambient airflow rate and

temperature. For a given airflow and ambient temperature, the

module output power is increased, until one (or more) of the

components reaches its maximum derated operating

temperature, as defined in IPC-9592A. This procedure is then

repeated for a different airflow or ambient temperature until a

family of module output derating curves is obtained.

Figure 13. Thermal Test Setup.

Heat Transfer via Convection

Increased airflow over the module enhances the heat transfer

via convection. Derating figures showing the maximum output

current that can be delivered by each module versus local

3m/s (600 ft./min) are shown in the respective Characteristics

Curves section.

Please refer to the Application Note “Thermal Characterization

Process For Open-Frame Board-Mounted Power Modules” for a

detailed discussion of thermal aspects including maximum

device temperatures.

Vin

5V

Tdip

Tfall = 10us

Trise = 5us