6

®

OPA3682

ABSOLUTE MAXIMUM RATINGS

Power Supply ..............................................................................

±6.5VDC

Differential Input Voltage ..................................................................

±1.2V

Input Voltage Range ............................................................................

±V

S

Storage Temperature Range: E, U ................................ –40

°C to +125°C

Lead Temperature (soldering, 10s) .............................................. +300

°C

NOTE:: (1) Packages must be derated based on specified

θ

must be observed.

PACKAGE

SPECIFIED

DRAWING

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE

RANGE

MARKING

MEDIA

OPA3682E

SSOP-16 Surface Mount

322

–40

°C to +85°C

OPA3682E

OPA3682E/250

Tape and Reel

""

"

"

"

OPA3682E/2K5

Tape and Reel

OPA3682U

SO-16 Surface Mount

265

–40

°C to +85°C

OPA3682U

OPA3682U/2K5

Tape and Reel

""

"

"

"

OPA3682U

Tube

NOTES: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. (2) Models with a slash (/) are

available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces of “OPA3682E/2K5” will get a single

2500-piece Tape and Reel. For detailed Tape and Reel mechanical information, refer to Appendix B of Burr-Brown IC Data Book.

PACKAGE/ORDERING INFORMATION

PIN CONFIGURATION

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

–IN A

+IN A

DIS B

–IN B

+IN B

DIS C

–IN C

+IN C

DIS A

+V

S

OUT A

–V

S

OUT B

+V

S

OUT C

–V

S

OPA3682

400

Ω

400

Ω

400

Ω

400

Ω

400

Ω

400

Ω

ELECTROSTATIC

DISCHARGE SENSITIVITY

Electrostatic discharge can cause damage ranging from perfor-

mance degradation to complete device failure. Burr-Brown Corpo-

ration recommends that all integrated circuits be handled and stored

using appropriate ESD protection methods.

ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes

could cause the device not to meet published specifications.

Top View

SSOP-16, SO-16