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OPA177 Datasheet(PDF) 3 Page - Burr-Brown (TI) |
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OPA177 Datasheet(HTML) 3 Page - Burr-Brown (TI) |
3 / 7 page 3 ® OPA177 The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems. PIN CONFIGURATION Top View DIP/SOIC ABSOLUTE MAXIMUM RATINGS ELECTROSTATIC DISCHARGE SENSITIVITY Any integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. ESD can cause damage ranging from subtle performance degradation to complete device failure. Precision integrated circuits may be more suscep- tible to damage because very small parametric changes could cause the device not to meet published specifications. Burr-Brown’s standard ESD test method consists of five 1000V positive and negative discharges (100pF in series with 1.5k Ω) applied to each pin. Failure to observe proper handling procedures could result in small changes to the OPA177’s input bias current. 1 2 3 4 8 7 6 5 Offset Trim –In +In V– Offset Trim V+ V No Internal Connection O Power Supply Voltage ....................................................................... ±22V Differential Input Voltage ................................................................... ±30V Input Voltage ....................................................................................... ±V S Output Short Circuit ................................................................. Continuous Operating Temperature: Plastic DIP (P), SO-8 (S) .............................................. –40 °C to +85°C θ JA (PDIP) ................................................................................. 100°C/W θ JA (SOIC) ................................................................................. 160°C/W Storage Temperature: Plastic DIP (P), SO-8 (S) ............................................ –65 °C to +125°C Junction Temperature .................................................................... +150 °C Lead Temperature (soldering, 10s) P packages ........................... +300 °C (soldering, 3s) S package ............................... +260 °C PACKAGE DRAWING TEMPERATURE PRODUCT PACKAGE NUMBER(1) RANGE OPA177FP 8-Pin Plastic DIP 006 –40 °C to +85°C OPA177GP 8-Pin Plastic DIP 006 –40 °C to +85°C OPA177GS SO-8 Surface-Mount 182 –40 °C to +85°C NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. PACKAGE/ORDERING INFORMATION |
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