3

®

AFE1124

PIN CONFIGURATION

PACKAGE

DRAWING

TEMPERATURE

PRODUCT

PACKAGE

RANGE

AFE1124E

28-Pin SSOP

324

–40 to +85

NOTE: (1) For detailed drawing and dimension table, please see end of data

sheet, or Appendix C of Burr-Brown IC Data Book.

PACKAGE/ORDERING INFORMATION

The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN

assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject

to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not

authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.

NC

NC

DV

DD

DGND

txbaudCLK

tx48xCLK

Data In

rxbaudCLK

rx48xCLK

Data Out

DV

DD

DGND

AV

DD

rxHYB–

NC

AGND

txLINE+

AV

DD

txLIKNE–

AGND

AV

DD

vrREFN

VCM

vrREFP

AGND

rxLINE+

rxLINE–

rxHYB+

1

2

3

4

5

6

7

8

9

10

11

12

13

14

28

27

26

25

24

23

22

21

20

19

18

17

16

15

AFE1124

Analog Inputs: Current ..............................................

±100mA, Momentary

±10mA, Continuous

Analog Outputs Short Circuit to Ground (+25

°C) ..................... Continuous

AGND, DGND, Differential Voltage ..................................................... 0.3V

Storage Temperature Range .......................................... –40

°C to +125°C

Lead Temperature (soldering, 3s) .................................................. +260

°C

Power Dissipation .......................................................................... 700mW

ABSOLUTE MAXIMUM RATINGS

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Burr-Brown

recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.