4

®

ADS7819

PIN CONFIGURATION

V

IN

AGND1

REF

CAP

AGND2

D11 (MSB)

D10

D9

D8

D7

D6

D5

D4

DGND

+V

ANA

+V

DIG

–V

ANA

BUSY

CS

R/C

DGND

+V

DIG

+V

ANA

D0 (LSB)

D1

D2

D3

1

2

3

4

5

6

7

8

9

10

11

12

13

14

28

27

26

25

24

23

22

21

20

19

18

17

16

15

ADS7819

NOTE: (1) Not Internally Connected.

PIN ASSIGNMENTS

DIGITAL

PIN #

NAME

I/O

DESCRIPTION

Analog Input. Connect via 50

Ω to analog input. Full-scale input range is ±2.5V.

2

AGND1

Analog Ground. Used internally as ground reference point. Minimal current flow.

3

REF

Reference Input/Output. Outputs internal reference of +2.5V nominal. Can also be driven by external system

reference. In both cases, decouple to ground with a 0.1

µF ceramic capacitor.

4

CAP

Reference Buffer Output. 10

µF tantalum capacitor to ground. Nominally +2V.

5

AGND2

Analog Ground.

6

D11 (MSB)

O

Data Bit 11. Most Significant Bit (MSB) of conversion results. Hi-Z state when CS is HIGH, or when R/C is

LOW, or when a conversion is in progress.

7

D10

O

Data Bit 10. Hi-Z state when CS is HIGH, or when R/C is LOW, or when a conversion is in progress.

8

D9

O

Data Bit 9. Hi-Z state when CS is HIGH, or when R/C is LOW, or when a conversion is in progress.

9

D8

O

Data Bit 8. Hi-Z state when CS is HIGH, or when R/C is LOW, or when a conversion is in progress.

10

D7

O

Data Bit 7. Hi-Z state when CS is HIGH, or when R/C is LOW, or when a conversion is in progress.

11

D6

O

Data Bit 6. Hi-Z state when CS is HIGH, or when R/C is LOW, or when a conversion is in progress.

12

D5

O

Data Bit 5. Hi-Z state when CS is HIGH, or when R/C is LOW, or when a conversion is in progress.

13

D4

O

Data Bit 4. Hi-Z state when CS is HIGH, or when R/C is LOW, or when a conversion is in progress.

14

DGND

Digital Ground.

15

D3

O

Data Bit 3. Hi-Z state when CS is HIGH, or when R/C is LOW, or when a conversion is in progress.

16

D2

O

Data Bit 2. Hi-Z state when CS is HIGH, or when R/C is LOW, or when a conversion is in progress.

17

D1

O

Data Bit 1. Hi-Z state when CS is HIGH, or when R/C is LOW, or when a conversion is in progress.

18

D0 (LSB)

O

Data Bit 0. Least Significant Bit (LSB) of conversion results. Hi-Z state when CS is HIGH, or when R/C is

LOW, or when a conversion is in progress.

19

Not internally connected.

20

Analog Positive Supply Input. Nominally +5V. Connect directly to pins 21, 27 and 28.

21

Digital Supply Input. Nominally +5V. Connect directly to pins 20, 27 and 28.

22

DGND

Digital ground.

23

R/C

I

Read/Convert Input. With CS LOW, a falling edge on R/C puts the internal sample/hold into the hold state and

starts a conversion. With CS LOW and no conversion in progress, a rising edge on R/C enables the output

data bits.

24

CS

I

Chip Select. With R/C LOW, a falling edge on CS will initiate a conversion. With R/C HIGH and no conversion

in progress, a falling edge on CS will enable the output data bits.

25

BUSY

O

Busy Output. Falls when a conversion is started, and remains LOW until the conversion is completed and the

data is latched into the output register. With CS LOW and R/C HIGH, output data will be valid when BUSY

rises, so that the rising edge can be used to latch the data.

26

Analog Negative Supply Input. Nominally –5V. Decouple to ground with 0.1

µF ceramic and 10µF tantalum

capacitors.

27

Digital Supply Input. Nominally +5V. Connect directly to pins 20, 21 and 28.

28

Analog Positive Supply Input. Nominally +5V. Connect directly to pins 20, 21 and 27, and decouple to ground

with 0.1

µF ceramic and 10µF tantalum capacitors.