© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com

T2016-1 • 1/17/2011

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KEMET Organic Capacitor (KO-CAP) – T521 High Voltage Polymer Tantalum

Polymer /Ta

Silver Adhesive

Carbon

Silver Paint

Washer

Tantalum Wire

Weld

Leadframe

(-Cathode)

Leadframe

(+Anode)

Time

25° C to Peak

25

Max Ramp Up Rate = 3° C/sec

Max Ramp Down Rate = 6° C/sec

Soldering Process

KEMET’s families of surface mount tantalum capacitors are

compatible with wave (single or dual), convection, IR or vapor

phase reflow techniques. Preheating of these components

is recommended to avoid extreme thermal stress. KEMET's

recommended profile conditions for convection and IR reflow reflect

the profile conditions of the IPC/J-STD-020D standard for moisture

sensitivety testing. The devices can safely withstand a maximum of

three reflow passes at these conditions.

Note that although the X/7343-43 case size can withstand wave

soldering, the tall profile (4.3mm maximum) dictates care in wave

process development.

Time/Temperature Soldering Profile

Profile Feature

Sn-Pb Assembly Pb-Free Assembly

Preheat/Soak

Temperature Min (T

100°C

150°C

Temperature Max (T

150°C

200°C

Time (t

60-120 sec

60-120 sec

Ramp-up rate (T

3°C/sec max

3°C/sec max

Liquidous temperature (T

183°C

217°C

Time above liquidous (t

60-150 sec

60-150 sec

Peak Temperature (T

220°C*

235°C**

250°C*

260°C**

Time within 5°C of max peak

temperature (t

20 sec max

30 sec max

Ramp-down rate (T

6°C/sec max

6°C/sec max

Time 25°C to peak temperature

6 minutes max

8 minutes max

Note 1: All temperatures refer to the center of the package, measured on the

package body surface that is facing up during assembly reflow.

* Case Size D, E, P, Y and X

**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W and Z

Construction