LM3697

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SNOSCS2A – NOVEMBER 2013 – REVISED DECEMBER 2013

ABSOLUTE MAXIMUM RATINGS

(1) (2)

−0.3V to +6V

−0.3V to +45V

−0.3V to +6V

−0.3V to +6V

Continuous Power Dissipation

Internally Limited

+150°C

Storage Temperature Range

− 65°C to +150°C

Maximum Lead Temperature (Soldering)

(3)

ESD Rating

2.0kV

1500 V

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

For detailed soldering specifications and information, please refer to Texas Instruments Application Note 1112: DSBGA Wafer Level

Chip Scale Package (SNVA009) available at www.ti.com.

(4)

ESD Human Body Model, ESD-HBM JESD22-A114.

(5)

ESD Charged Device Model, ESD-CDM JESD22-C101.

OPERATING RATINGS

(1) (2)

2.7V to 5.5V

0V to +40V

(3) (4)

−40°C to +125°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

(4)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

part/package in the application (

THERMAL PROPERTIES

Thermal Resistance Junction to Ambient (

(1)

55.3°C/W

(1)

Junction-to-ambient thermal resistance (

forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 102 mm x 76 mm x 1.6 mm with a 2 x 1 array

of thermal vias. The ground plane on the board is 50 mm x 50 mm. Thickness of copper layers are 36 µm/18 µm/18 µm/36 µm (1.5

oz/1oz/1oz/1.5 oz). Ambient temperature in simulation is 22°C in still air. Power dissipation is 1W. The value of

DSBGA package could fall in a range as wide as 60°C/W to 110°C/W (if not wider), depending on PCB material, layout, and

environmental conditions. In applications where high maximum power dissipation exists special care must be paid to thermal dissipation

issues.

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