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QIS2510001 Datasheet(PDF) 2 Page - Powerex Power Semiconductors

Part # QIS2510001
Description  Single Discrete IGBT 100 Amperes/2500 Volts
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Manufacturer  POWEREX [Powerex Power Semiconductors]
Direct Link  http://www.pwrx.com
Logo POWEREX - Powerex Power Semiconductors

QIS2510001 Datasheet(HTML) 2 Page - Powerex Power Semiconductors

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Preliminary
QIS2510001
Single Discrete IGBT
100 Amperes/2500 Volts
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com
01/10 Rev. 0
Maximum Ratings,
Tj = 25 °C unless otherwise specified
Ratings
Symbol
QIS2510001
Units
Collector Emitter Voltage
VCES
2500
Volts
Gate Emitter Voltage
VGES
±20
Volts
Collector Current (DC, TC = 127°C)
IC
100
Amperes
Peak Collector Current (Pulsed)
ICM
200*
Amperes
Junction Temperature
Tj
-55 to 150
°C
Storage Temperature
Tstg
-55 to 125
°C
Mounting Torque, M5 Mounting Screws
30
in-lb
Weight (Typical)
20
Grams
Static Electrical Characteristics,
Tj = 25 °C unless otherwise specified
Characteristics
Symbol
Test Conditions
Min.
Typ.
Max.
Units
Collector Cutoff Current
ICES
VCE = VCES, VGE = 0V
1.0
mA
Gate Leakage Current
IGES
VGE = VGES, VCE = 0V
0.5
µA
Gate-Emitter Threshold Voltage
VGE(th)
IC = 10mA, VCE = 10V
4.5
6.0
7.5
Volts
Collector-Emitter Saturation Voltage
VCE(sat)
IC = 100A, VGE = 15V, Tj = 25°C
3.20
4.20**
Volts
IC = 100A, VGE = 15V, Tj = 125°C
3.60
Volts
Total Gate Charge
QG
VCC = 1250V, IC = 100A, VGE = 15V
450
nC
Dynamic Electrical Characteristics,
Tj = 25 °C unless otherwise specified
Characteristics
Symbol
Test Conditions
Min.
Typ.
Max.
Units
Input Capacitance
Cies
10
nF
Output Capacitance
Coes
VGE = 0V, VCE = 10V
1.1
nF
Reverse Transfer Capacitance
Cres
330
pF
Resistive
Turn-on Delay Time
td(on)
VCC = 1250V,
TBD
µs
Load
Rise Time
tr
IC = 100A,
TBD
µs
Switching
Turn-off Delay Time
td(off)
VGE1 = VGE2 = 15V,
TBD
µs
Times
Fall Time
tf
RG = 30Ω
TBD
µs
Turn-on Switching Energy
Eon
Tj = 125°C, IC = 100A, VCC = 1250V,
125
mJ/P
Turn-off switching Energy
Eoff
VGE = ±15V, RG = 30Ω, Inductive Load
100
mJ/P
Thermal and Mechanical Characteristics,
Tj = 25 °C unless otherwise specified
Characteristics
Symbol
Test Conditions
Min.
Typ.
Max.
Units
Thermal Resistance, Junction to Case
Rth(j-c)
IGBT
0.10
TBD
°C/W
Thermal Resistance, Case to Sink
Rth(c-s)
λgrease = 1W/mK
0.10
°C/W
Thermal Grease Applied
* Pulse width and repetition rate should be such that device junction temperature (Tj) does not exceed device rating.
**Pulse width and repetition rate should be such that device junction temperature rise is negligible.


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