NX3008PBKW

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© NXP B.V. 2011. All rights reserved.

Product data sheet

Rev. 1 — 1 August 2011

5 of 16

NXP Semiconductors

NX3008PBKW

30 V, 200 mA P-channel Trench MOSFET

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

Table 6.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from junction to ambient

in free air

[1] -

415

480

K/W

[2] -

350

400

K/W

thermal resistance from junction to solder point

-

-

150

K/W

FR4 PCB, standard footprint

Fig 4.

Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

Fig 5.

Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

017aaa028

10

1

10

(K/W)

1

duty cycle = 1

0.75

0.5

0.33

0.25

0.2

0.1

0.05

0.02

0.01

0

017aaa029

10

1

10

(K/W)

1

duty cycle = 1

0.75

0.5

0.33

0.25

0.2

0.1

0.05

0.02

0.01

0