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OPA3692IDBQT Datasheet(PDF) 2 Page - Texas Instruments |
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OPA3692IDBQT Datasheet(HTML) 2 Page - Texas Instruments |
2 / 27 page OPA3692 SBOS228E 2 www.ti.com AC PERFORMANCE (see Figure 1) Small-Signal Bandwidth (VO < 0.5VPP) G = +1 280 MHz typ C G = +2 225 185 180 170 MHz min B G = –1 220 MHz typ C Bandwidth for 0.1dB Gain Flatness G = +2, VO < 0.5VPP 120 40 35 30 MHz min B Peaking at a Gain of +1 VO < 0.5Vp-p 0.2 1 1.5 2 dB max B Large-Signal Bandwidth G = +2, VO = 5VPP 220 MHz typ C Slew Rate G = +2, 4V Step 2000 1400 1375 1350 V/ µsmin B Rise-and-Fall Time G = +2, VO = 0.5V Step 1.6 ns typ C G = +2, VO = 5V Step 1.9 ns typ C ABSOLUTE MAXIMUM RATINGS(1) Power Supply ............................................................................... ±6.5V DC Internal Power Dissipation(2) ............................ See Thermal Information Differential Input Voltage(3) ............................................................... ±1.2V Input Voltage Range ............................................................................ ±V S Storage Temperature Range: D, DBQ ........................... –65 °C to +125°C Lead Temperature (soldering, 10s) .............................................. +300 °C Junction Temperature (TJ ) ........................................................... +175°C ESD Resistance: HBM .................................................................... 2000V CDM .................................................................... 1500V MM ........................................................................ 200V NOTES: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. (2) Packages must be derated based on specified θ JA. Maximum TJ must be observed. (3) Noninverting input to internal inverting node. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instru- ments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PIN CONFIGURATION Top View SSOP, SO SPECIFIED PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING NUMBER MEDIA, QUANTITY OPA3692 SO-16 D –40 °C to +85°C OPA3692 OPA3692ID Rails, 48 "" " " " OPA3692IDR Tape and Reel, 2500 OPA3692 SSOP-16 DBQ –40 °C to +85°C OPA3692 OPA3692IDBQT Tape and Reel, 250 "" " " " OPA3692IDBQR Tape and Reel, 2500 PACKAGE/ORDERING INFORMATION(1) NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 –IN A +IN A DIS B –IN B +IN B DIS C –IN C +IN C DIS A +V S OUT A –V S OUT B +V S OUT C –V S OPA3692 402 Ω 402 Ω 402 Ω 402 Ω 402 Ω 402 Ω ELECTRICAL CHARACTERISTICS: VS = ±5V Boldface limits are tested at +25 °C. G = +2 (–IN grounded) and RL = 100Ω (see Figure 1 for AC performance only), unless otherwise noted. OPA3692ID, OPA3692IDBQ TYP MIN/MAX OVER TEMPERATURE(1) 0 °C to –40 °C to MIN/ TEST PARAMETER CONDITIONS +25 °C +25 °C70°C +85 °C UNITS MAX LEVEL(2 ) |
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