W181

Document #: 38-07152 Rev. *D

Page 8 of 9

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marks of their respective holders.

Package Drawing and Dimension

14

PIN1ID

SEATING

PLANE

1

BSC.

BSC

0°-8°

PLANE

GAUGE

4.90[0.193]

1.10[0.043] MAX.

0.65[0.025]

0.20[0.008]

0.05[0.002]

6.50[0.256]

0.076[0.003]

6.25[0.246]

4.50[0.177]

4.30[0.169]

5.10[0.200]

0.15[0.006]

0.19[0.007]

0.30[0.012]

0.09[[0.003]

0.25[0.010]

0.70[0.027]

0.50[0.020]

0.95[0.037]

0.85[0.033]

14-Lead Thin Shrunk Small Outline Package (4.40-mm Body) Z14

51-85117-*A

DIMENSIONS IN MM(INCHES)

SEATING PLANE

PIN1ID

0.230[5.842]

0.244[6.197]

0.157[3.987]

0.150[3.810]

0.189[4.800]

0.196[4.978]

0.050[1.270]

BSC

0.061[1.549]

0.068[1.727]

0.004[0.102]

0.0098[0.249]

0.0138[0.350]

0.0192[0.487]

0.016[0.406]

0.035[0.889]

0.0075[0.190]

0.0098[0.249]

1. DIMENSIONS IN INCHES[MM] MIN.

MAX.

0°~8°

0.016[0.406]

0.010[0.254]

X 45°

2. PIN 1 ID IS OPTIONAL,

ROUND ON SINGLE LEADFRAME

RECTANGULAR ON MATRIX LEADFRAME

0.004[0.102]

8 Lead (150 Mil) SOIC - S08

1

4

58

3. REFERENCE JEDEC MS-012

PART #

S08.15 STANDARD PKG.

SZ08.15 LEAD FREE PKG.

4. PACKAGE WEIGHT 0.07gms

51-85066-*C

8-lead (150-Mil) SOIC S8