LUXEON Z Datasheet DS105 20120516

9

Table 8.

Profile Feature

Lead Free Assembly

Average Ramp-Up Rate (Ts

3°C / second max

Preheat Temperature Min (Ts

150°C

Preheat Temperature Max (Ts

200°C

Preheat Time (ts

60 - 180 seconds

Temperature T

217°C

Time Maintained Above Temperature T

60 - 150 seconds

Peak / Classification Temperature (T

260°C

Time Within 5°C of Actual Peak Temperature (t

20 - 40 seconds

Ramp-Down Rate

6°C / second max

Time 25°C to Peak Temperature

8 minutes max

Note for Table 8:

- All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body.

Reflow Soldering Characteristics

JEDEC 020c