MKP 1840 M

MKP Radial Potted Type

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Document Number: 26018

154

Revision: 01-Jul-10

HEAT CONDUCTIVITY (G) AS A FUNCTION OF ORIGINAL PITCH AND CAPACITOR BODY

THICKNESS IN mW/°C

POWER DISSIPATION AND MAXIMUM COMPONENT TEMPERATURE RISE

The power dissipation must be limited in order not to exceed the maximum allowed component temperature rise as a function of

the free air ambient temperature.

The power dissipation can be calculated according type detail specification “HQN-384-01/101: Technical Information Film

Capacitors” with the typical tgd of the curves.

The component temperature rise (

ΔT) can be measured (see section “Measuring the Component Temperature” for more details)

or calculated by

ΔT = P/G:

•

ΔT = Component temperature rise (°C)

• P = Power dissipation of the component (mW)

• G = Heat conductivity of the component (mW/°C)

(mm)

HEAT CONDUCTIVITY (mW/°C)

PITCH 5 mm

PITCH 7.5 mm

PITCH 10 mm

PITCH 15 mm

PITCH 22.5 mm PITCH 27.5 mm PITCH 37.5 mm

3.0

2.5

4.0

-

-

-

-

-

3.5

3.5

--

---

-

4.0

-

5.0

6.0

-

-

-

-

4.5

4.5

5.5

6.5

-

-

-

-

5.0

5.0

6.5

-

-

-

-

-

5.5

6.5

-

7.5

9.0

-

-

-

5.7

-

7.5

-

-

-

-

-

6.0

-

-

-

10.5

-

-

-

6.5

-

-

9.0

11.5

17.0

-

-

7.5

-

-

-

13.5

19.0

-

-

8.5

-

-

-

15.0

16.5

-

-

9.0

-

-

-

-

22.5

-

-

10.5

-

-

-

-

26.5

-

-

11.0

-

-

-

-

30.5

-

-

11.5

-

-

-

-

-

33.5

-

13.5

-

-

-

-

-

41.0

-

14.5

-

-

-

-

-

-

52.0

15.0

-

-

-

-

-

45.0

-

16.5

-

-

-

-

-

57.0

-

18.0

-

-

-

-

-

57.0

-

18.0

-

-

-

-

-

67.0

-

18.0

-

-

-

-

-

-

75.5

20.0

-

-

-

-

-

-

99.0