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CL05C100JB5NNNC Datasheet(PDF) 1 Page - Samsung semiconductor

Part # CL05C100JB5NNNC
Description  SPECIFICATION
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

CL05C100JB5NNNC Datasheet(HTML) 1 Page - Samsung semiconductor

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SPECIFICATION
•••• Supplier : Samsung electro-mechanics
•••• Samsung P/N : CL05C100JB5NNNC
•••• Product : Multi-layer Ceramic Capacitor
•••• Description :
CAP, 10㎊
㎊, 50V, ±5%, C0G, 0402
CL
05
C
100
J
B
5
N
N
N
C
① Series
Samsung Multi-layer Ceramic Capacitor
② Size
0402
(inch code)
L: 1.0 ± 0.05
mm
W:
± 0.05 mm
③ Dielectric
C0G
⑧ Inner electrode
④ Capacitance
10
Termination
⑤ Capacitance
±5
%
Plating
(Pb Free)
tolerance
⑨ Product
Normal
⑥ Rated Voltage
50 V
⑩ Special
Reserved for future use
⑦ Thickness
0.5 ± 0.05
mm
⑪ Packaging
Cardboard Type, 7" reel
B. Samsung Reliablility Test and Judgement condition
Capacitance
Within specified tolerance
1㎒±10%
0.5~5Vrms
Q
600 min
Insulation
10,000Mohm or 500Mohm⋅㎌
Rated Voltage
60~120 sec.
Resistance
Whichever is Smaller
Appearance
No abnormal exterior appearance
Microscope (×10)
Withstanding
No dielectric breakdown or
of the rated voltage
Voltage
mechanical breakdown
Temperature
C0G
Characterisitcs
(From -55℃ to 125℃, Capacitance change shoud be within ±30PPM/℃)
Adhesive Strength
No peeling shall be occur on the
500g⋅F, for 10±1 sec.
of Termination
terminal electrode
Bending Strength
Capacitance change :
Bending to the limit (1mm)
within ±5% or ±0.5㎊ whichever is larger
with 1.0mm/sec.
Solderability
More than 75% of terminal surface
SnAg3.0Cu0.5 solder
is to be soldered newly
245±5℃, 3±0.3sec.
(preheating : 80~120℃ for 10~30sec.)
Resistance to
Capacitance change :
Solder pot : 270±5℃, 10±1sec.
Soldering heat
within ±2.5% or ±0.25㎊ whichever is larger
Tan δ, IR : initial spec.
Performance
Test condition
300%
A. Samsung Part Number
Sn 100%
Cu
Ni
0.5


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