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CL05C100JB5NNNC Datasheet(PDF) 1 Page - Samsung semiconductor |
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CL05C100JB5NNNC Datasheet(HTML) 1 Page - Samsung semiconductor |
1 / 2 page SPECIFICATION •••• Supplier : Samsung electro-mechanics •••• Samsung P/N : CL05C100JB5NNNC •••• Product : Multi-layer Ceramic Capacitor •••• Description : CAP, 10㎊ ㎊ ㎊ ㎊, 50V, ±5%, C0G, 0402 CL 05 C 100 J B 5 N N N C ① ① ① ① ② ② ② ② ③ ③ ③ ③ ④ ④ ④ ④ ⑤ ⑤ ⑤ ⑤ ⑥ ⑥ ⑥ ⑥ ⑦ ⑦ ⑦ ⑦ ⑧ ⑧ ⑧ ⑧ ⑨ ⑨ ⑨ ⑨ ⑩ ⑩ ⑩ ⑩ ⑪ ⑪ ⑪ ⑪ ① ① ① ① Series Samsung Multi-layer Ceramic Capacitor ② ② ② ② Size 0402 (inch code) L: 1.0 ± 0.05 mm W: ± 0.05 mm ③ ③ ③ ③ Dielectric C0G ⑧ ⑧ ⑧ ⑧ Inner electrode ④ ④ ④ ④ Capacitance 10 ㎊ Termination ⑤ ⑤ ⑤ ⑤ Capacitance ±5 % Plating (Pb Free) tolerance ⑨ ⑨ ⑨ ⑨ Product Normal ⑥ ⑥ ⑥ ⑥ Rated Voltage 50 V ⑩ ⑩ ⑩ ⑩ Special Reserved for future use ⑦ ⑦ ⑦ ⑦ Thickness 0.5 ± 0.05 mm ⑪ ⑪ ⑪ ⑪ Packaging Cardboard Type, 7" reel B. Samsung Reliablility Test and Judgement condition Capacitance Within specified tolerance 1㎒±10% 0.5~5Vrms Q 600 min Insulation 10,000Mohm or 500Mohm⋅㎌ Rated Voltage 60~120 sec. Resistance Whichever is Smaller Appearance No abnormal exterior appearance Microscope (×10) Withstanding No dielectric breakdown or of the rated voltage Voltage mechanical breakdown Temperature C0G Characterisitcs (From -55℃ to 125℃, Capacitance change shoud be within ±30PPM/℃) Adhesive Strength No peeling shall be occur on the 500g⋅F, for 10±1 sec. of Termination terminal electrode Bending Strength Capacitance change : Bending to the limit (1mm) within ±5% or ±0.5㎊ whichever is larger with 1.0mm/sec. Solderability More than 75% of terminal surface SnAg3.0Cu0.5 solder is to be soldered newly 245±5℃, 3±0.3sec. (preheating : 80~120℃ for 10~30sec.) Resistance to Capacitance change : Solder pot : 270±5℃, 10±1sec. Soldering heat within ±2.5% or ±0.25㎊ whichever is larger Tan δ, IR : initial spec. Performance Test condition 300% A. Samsung Part Number Sn 100% Cu Ni 0.5 |
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