LP38852S-ADJ datasheet(5/29 Pages) TI

Part #	LP38852S-ADJ

Description	1.5A Fast-Response High-Accuracy Adjustable LDO Linear Regulator with Enable and Soft-Start

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Manufacturer	TI [Texas Instruments]

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LP38852

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SNVS482E – JANUARY 2007 – REVISED APRIL 2013

Electrical Characteristics (continued)

Unless otherwise specified: VOUT = 0.80V, VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, VEN = VBIAS, IOUT = 10 mA, CIN = COUT = 10 µF,

CBIAS = 1 µF, CSS = open. Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction

temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are ensured through test, design, or statistical

correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes

only.

Symbol

Parameter

Conditions

MIN

TYP

MAX

Units

AC Parameters

VIN = VOUT(NOM) + 1V, f = 120 Hz

-

80

-

PSRR

Ripple Rejection for VIN Input

(VIN)

Voltage

VIN = VOUT(NOM) + 1V, f = 1 kHz

-

65

-

dB

VBIAS = VOUT(NOM) + 3V, f = 120 Hz

-

58

-

PSRR

Ripple Rejection for VBIAS Voltage

(VBIAS)

VBIAS = VOUT(NOM) + 3V, f = 1 kHz

-

58

-

Output Noise Density

f = 120 Hz

-

1

-

µV/

√Hz

en

BW = 10 Hz

− 100 kHz

-

150

-

Output Noise Voltage

µVRMS

BW = 300 Hz

− 300 kHz

-

90

-

Thermal Parameters

Thermal Shutdown Junction

TSD

-

160

-

Temperature

°C

TSD(HYS)

Thermal Shutdown Hysteresis

-

10

-

TO-220-7

-

60

-

Thermal Resistance, Junction to

θJ-A

DDPAK-7

-

60

-

Ambient(5)

SO PowerPAD-8

-

168

-

°C/W

TO-220-7

-

3

-

Thermal Resistance, Junction to

θJ-C

DDPAK-7

-

3

-

Case(5)(6)

SO PowerPAD-8

-

11

-

(5)

Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction to

ambient thermal resistance (

θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not

exceed the maximum operating rating. See the Application Information section for details.

(6)

For TO-220 and DDPAK:

θJ-C refers to the BOTTOM surface of the package, under the epoxy body, as the 'CASE'. For SO PowerPAD-

8:

θJ-C refers to the DAP (aka: Exposed Pad) on BOTTOM surface of the package as the 'CASE'.

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