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LP38693 Datasheet(PDF) 2 Page - Texas Instruments |
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LP38693 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 27 page VIN 2 3 4 5 6 1 GND N/C VOUT SNS VIN Exposed Pad on Bottom (DAP) VIN 2 3 4 5 6 1 GND VEN VOUT SNS VIN Exposed Pad on Bottom (DAP) N/C VOUT GND VEN VIN 1 2 4 3 5 LP38691, LP38693 SNVS321K – JANUARY 2005 – REVISED APRIL 2013 www.ti.com Connection Diagrams Figure 1. PFM (LP38691DT-X.X) – Top View Figure 2. SOT-223 (LP38693MP-X.X) – Top View See Package Number NDP0003B See Package Number NDC0005A Figure 3. 6-Lead WSON (LP38691SD-X.X) – Top Figure 4. 6-Lead WSON (LP38693SD-X.X) – Top View View See Package Number NGG0006A See Package Number NGG PIN DESCRIPTIONS Pin Description This is the input supply voltage to the regulator. For WSON devices, both VIN pins must be tied together for VIN full current operation (250mA maximum per pin). Circuit ground for the regulator. For the PFM and SOT-223 packages this is thermally connected to the die GND and functions as a heat sink when the soldered down to a large copper plane. Output sense pin allows remote sensing at the load which will eliminate the error in output voltage due to SNS voltage drops caused by the resistance in the traces between the regulator and the load. This pin must be tied to VOUT. VEN The enable pin allows the part to be turned ON and OFF by pulling this pin high or low. VOUT Regulated output voltage WSON Only - The DAP (Exposed Pad) functions as a thermal connection when soldered to a copper plane. DAP See WSON MOUNTING section in APPLICATION HINTS for more information. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LP38691 LP38693 |
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