Innovator in Electronics – 15

C-29-C

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urata.com

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Choose a mounting position that minimizes the stress

imposed on the chip during flexing or bending of the

board.

1. Mounting Position

Locate chip

horizontal to the

direction in

which stress

acts

Chip arrangement

Worst A-C-(B~D) Best

Component Direction

Chip Mounting Close to Board Separation Point

A

B

D

C

Perforation

Slit

Continued on the following page.

2. Chip Placing

An excessively low bottom dead point of the suction

nozzle imposes great force on the chip during mounting,

causing cracked chips. So adjust the suction nozzle's

bottom dead point by correcting warp in the board.

Normally, the suction nozzle's bottom dead point must be

set on the upper surface of the board. Nozzle pressure

for chip mounting must be a 1 to 3N static load.

Dirt particles and dust accumulated between the suction

nozzle and the cylinder inner wall prevent the nozzle from

moving smoothly. This imposes great force on the chip

during mounting, causing cracked chips. And the locating

claw, when worn out, imposes uneven forces on the chip

when positioning, causing cracked chips. The suction

nozzle and the locating claw must be maintained,

checked and replaced periodically.

Board Guide

Correct

Suction Nozzle

Board

Support Pin

Incorrect

Deflection

!

Caution (Soldering and Mounting)

!

Caution

13

!

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

83

ï This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, itís specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our

sales representatives or product engineers before ordering.

ï This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

C02E.pdf

07.2.6

Applic Ation Speci F ic cA pA cit or S

High Frequency Ceramic Capacitors

GJM Soldering and Mounting