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NCV8405 Datasheet(PDF) 2 Page - ON Semiconductor

Part # NCV8405
Description  Self-Protected Low Side Driver with Temperature and Current Limit
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCV8405 Datasheet(HTML) 2 Page - ON Semiconductor

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NCV8405, NCV8405A
http://onsemi.com
2
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Drain−to−Source Voltage Internally Clamped
VDSS
42
V
Drain−to−Gate Voltage Internally Clamped
(RG = 1.0 MW)
VDGR
42
V
Gate−to−Source Voltage
VGS
"14
V
Continuous Drain Current
ID
Internally Limited
Power Dissipation − SOT−223 Version
@ TA = 25°C (Note 1)
@ TA = 25°C (Note 2)
@ TT = 25°C (Note 1)
Power Dissipation − DPAK Version
@ TA = 25°C (Note 1)
@ TA = 25°C (Note 2)
@ TC = 25°C (Note 1)
PD
1.0
1.7
11.4
2.0
2.5
40
W
Thermal Resistance − SOT−223 Version
Junction−to−Ambient Steady State (Note 1)
Junction−to−Ambient Steady State (Note 2)
Junction−to−Tab Steady State (Note 1)
Thermal Resistance − DPAK Version
Junction−to−Ambient Steady State (Note 1)
Junction−to−Ambient Steady State (Note 2)
Junction−to−Case Steady State (Note 1)
RqJA
RqJA
RqJT
RqJA
RqJA
RqJT
130
72
11
60
50
3.0
°C/W
Single Pulse Drain−to−Source Avalanche Energy
(VDD = 40 V, VG = 5.0 V, IPK = 2.8 A, L = 80 mH, RG(ext) = 25 W, TJ = 25°C)
EAS
275
mJ
Load Dump Voltage
VLD = VA + VS (VGS = 0 and 10 V, RI = 2.0 W, RL = 6.0 W, td = 400 ms)
VLD
53
V
Operating Junction Temperature
TJ
−40 to 150
°C
Storage Temperature
Tstg
−55 to 150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Surface−mounted onto min pad FR4 PCB, (2 oz. Cu, 0.06″ thick).
2. Surface−mounted onto 2″ sq. FR4 board (1″ sq., 1 oz. Cu, 0.06″ thick).
DRAIN
SOURCE
GATE
VDS
VGS
ID
IG
+
+
Figure 1. Voltage and Current Convention


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