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LR2010-R10FI Datasheet(PDF) 2 Page - List of Unclassifed Manufacturers |
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LR2010-R10FI Datasheet(HTML) 2 Page - List of Unclassifed Manufacturers |
2 / 2 page Low Value Flat Chip Resistor LRC/LRF Series www.bitechnologies.com www.irctt.com www.welwyn-tt.com General Note TT electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT electronics’ own data and is considered accurate at time of going to print. © TT electronics plc 03.13 Low Value Flat Chip Resistor LRC/LRF Series © Welwyn Components Limited Bedlington, Northumberland NE22 7AA, UK Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com 04.10 Welwyn Components Dimensions (mm) A B C LR1206 2.0 4.0 1.25 LR2010 3.05 6.5 1.5 LR2512 3.7 7.75 1.5 Note: 1. Although 2010 and 2512 sizes have passed temperature cycling and thermal shock, it is in general not recommended that ceramic chips this large be used on FR4 in a severe temperature cycle environment due to the possibility of solder joint fatigue. 2. Full AEC-Q200 qualification applies to ohmic values ≥R01. A C B LRC-LRF_E.qxd 12/23/04 10:07 AM Page 2 LRC 2512 1 w att LRC 2512 2 w att LRC 2010 0.5 watt LRC 2010 1 w att LRC 1206 0.25 watt LRC 1206 0.5 watt 25 70 150 (°C) 0 20 40 60 80 100 (%) Ambient temperature Ordering Procedure Example: LRF2512 at 10 milliohms (hence flip-chip mounted) and 2% tolerance on a reel of 1800 pieces L R F 2 5 1 2 – R 0 1 G W Type Mounting Conventional (element up) Values > R025 F Flip-chip (element down) Size Value (use IEC62 code) Tolerance (use IEC62 code) F 1% G 2% J 5% Packing W Tape 1206 or 2010 3000/reel Standard 2512 1800/reel T1 All sizes 1000/reel Values < R025 AEC-Q200 Table 7 Method Max. (add R05) Typ. (@1R0) ref Test 3 High Temp. Exposure MIL-STD-202 Method 108 R% 0.5 0.2 4 Temperature Cycling JESD22 Method JA-104 R% 0.25 0.1 6 Moisture Resistance MIL-STD-202 Method 106 R% 0.5 0.2 7 Biased Humidity MIL-STD-202 Method 103 R% 0.5 0.2 8 Operational Life (Cyclic Load) MIL-STD-202 Method 108 R% 1 0.5 14 Vibration MIL-STD-202 Method 204 R% 0.5 0.05 15 Resistance to Soldering Heat MIL-STD-202 Method 210 R% 0.25 0.05 16 Thermal Shock MIL-STD-202 Method 107 R% 0.25 0.1 18 Solderability J-STD-002 >95% coverage 21 Board Flex AEC-Q200-005 R% 0.5 0.2 22 Terminal Strength AEC-Q200-006 R% 0.25 0.1 Short Term Overload 6.25 x Pr for 2s R% 0.5 Low Temperature Storage -65°C for 100 hours R% 0.5 Leach Resistance Solder dip at 250°C 90s minimum |
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