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NCP1605DR2G Datasheet(PDF) 2 Page - ON Semiconductor |
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NCP1605DR2G Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 32 page NCP1605, NCP1605A, NCP1605B http://onsemi.com 2 EMI Filter Ac line LOAD L1 D1 Rcs M1 Cbo 1 2 3 4 13 16 14 15 5 6 7 89 12 10 11 Ct pfcOK STBY control FB OVP Rzcd Rdrv Cin Rocp Rbo2 Rbo1 + Vout + VCC CVCC Icoil Vin Cbulk VCC Vout Cosc Rovp1 Rovp2 Rout1 CVref CVctrl Rout2 Icoil Figure 1. MAXIMUM RATINGS Pin Rating Symbol Value Unit 11 Power Supply Input VCC −0.3, +20 V 11 Maximum Transient Voltage (Note 1) VCC −0.3, +25 V 1, 2, 4, 5, 6, 7, 8, 13 and 14 Input Voltage VI −0.3, +9 V 6 Maximum Current ICSOUT/ZCD −3, 10 mA 3 VCONTROL Pin VCONTROL −0.3, VCONTROL MAX (Note 2) V 16 High Voltage Pin VHV −0.3, 600 V V Power Dissipation and Thermal Characteristics: Maximum Power Dissipation @ TA = 70°C Thermal Resistance Junction−to−Air PD RqJA 550 145 mW °C/W Operating Junction Temperature Range TJ −40, +125 °C Maximum Junction Temperature TJmax 150 °C Storage Temperature Range TSmax −65 to 150° °C Lead Temperature (Soldering, 10 s) TLmax 300 °C ESD Capability, HBM Model (all pins except HV) (Note 3) HBM 2000 V ESD Capability, MM Model (all pins except HV) (Note 3) MM 200 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The maximum transient voltage with a corresponding maximum transient current at 100 mA. The maximum transient power handling capability must be observed as well. 2. “VCONTROLMAX” is the pin clamp voltage. 3. This device series contains ESD protection rated using the following tests: Human Body Model (HBM) 2000V per JEDEC Standard JESD22, Method A114E. Machine Model (MM) 200V per JEDEC Standard JESD22, Method A115A. 4. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78. |
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