NCP1605, NCP1605A, NCP1605B

http://onsemi.com

2

EMI

Filter

Ac line

LOAD

L1

D1

Rcs

M1

Cbo

1

2

3

4 13

16

14

15

5

6

7

89

12

10

11

Ct

pfcOK

STBY control

FB

OVP

Rzcd

Rdrv

+

+

Figure 1.

MAXIMUM RATINGS

Pin

Rating

Symbol

Value

Unit

11

Power Supply Input

−0.3, +20

V

11

Maximum Transient Voltage (Note 1)

−0.3, +25

V

1, 2, 4, 5, 6, 7, 8,

13 and 14

Input Voltage

−0.3, +9

V

6

Maximum Current

−3, 10

mA

3

(Note 2)

V

16

High Voltage Pin

−0.3, 600 V

V

Power Dissipation and Thermal Characteristics:

Thermal Resistance Junction−to−Air

550

145

mW

°C/W

Operating Junction Temperature Range

−40, +125

°C

Maximum Junction Temperature

150

°C

Storage Temperature Range

−65 to 150°

°C

Lead Temperature (Soldering, 10 s)

300

°C

ESD Capability, HBM Model (all pins except HV) (Note 3)

HBM

2000

V

ESD Capability, MM Model (all pins except HV) (Note 3)

MM

200

V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. The maximum transient voltage with a corresponding maximum transient current at 100 mA. The maximum transient power handling capability

must be observed as well.

3. This device series contains ESD protection rated using the following tests:

Human Body Model (HBM) 2000V per JEDEC Standard JESD22, Method A114E.

Machine Model (MM) 200V per JEDEC Standard JESD22, Method A115A.

4. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78.