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AS13985F12-T Datasheet(PDF) 4 Page - ams AG |
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AS13985F12-T Datasheet(HTML) 4 Page - ams AG |
4 / 13 page www.austriamicrosystems.com Revision 1.13 3 - 12 AS13985 Datasheet - A b s o l u t e M a x i m u m R a t i n g s 5 Absolute Maximum Ratings Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. P(MAX) = (TJ(MAX) - (TAMB))/ ΘJA (EQ 1) Where: The value of ΘJA for the SOT23 package is 220ºC/W in a typical PC-board mounting. The value of ΘJA for the WLP package is 225ºC/W. Note: Exceeding the maximum allowable dissipation will cause excessive device temperature and the regula- tor will go into thermal shutdown. Table 2. Absolute Maximum Ratings Parameter Min Max Units Comments Input Supply Voltage (Survival) -0.3 +7 V Input Supply Voltage (Operating) +2.5 +5.5 V Shutdown Input Voltage (Survival) -0.3 +7 V Output Voltage (Survival) -0.3 +7 V IOUT (Survival) Short-circuit protected. Input/Output Voltage (Survival) 1 1. The output PNP structure contains a diode between pins VIN and VOUT that is normally reverse-biased. revers- ing the polarity of pins VIN and VOUT will activate this diode. -0.3 +7 V Power Dissipation 2 2. The maximum allowable power dissipation is a function of the maximum junction temperature (TJ(MAX), the junction-to-ambient thermal resistance ( ΘJA), and the ambient temperature (TAMB). The maximum allowable power dissipation at any ambient temperature is calculated as: Internally limited. Operating Junction Temperature -40 +125 ºC Storage Temperature Range -65 +150 ºC Package Body Temperature +260 ºC The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/ JEDEC J-STD-020D “Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”. The lead finish for Pb-free leaded packages is matte tin (100% Sn). |
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