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AS3647/47B

Datasheet, Confidential - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Table 4, “Electrical

Characteristics,” on page 6 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 3. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

VIN to GND

-0.3

+7.0

V

STROBE, TXMASK/TORCH, SCL, SDA to

GND

-0.3

VIN +

0.3

Vmax. +7V

SW1/2/3, VOUT1/2, LED_OUT1/2 to GND

-0.3

+7.0

V

VOUT1/2 to SW1/2/3

-0.3

V

Note: Diode between VOUT1/2 and

SW1/2/3

voltage between 2xGND, GNDA pins

0.0

0.0

V

short connection recommended

Input Pin Current without causing latchup

-100

+100

mA

Norm: EIA/JESD78

Continuous power dissipation

1230

mW

1

1. Depending on actual PCB layout and PCB used measured on demoboard; for peak power dissipation during

flashing see document 'AS3647/47B Thermal Measurements'

Continuous power dissipation derating factor

16.7

mW/ºC

2

Electrostatic Discharge

ESD HBM

pins LED_OUT1/2

3

pins connected together

±8000

V

Norm: JEDEC JESD22-A114F

ESD HBM

±2000

V

ESD CDM

±500

V

Norm: JEDEC JESD 22-C101E

ESD MM

±100

V

Norm: JEDEC JESD 22-A115-B

Temperature Ranges and Storage Conditions

Junction to ambient thermal resistance

60

4

4. Measured on AS3647/47B Demoboard.

ºC/W

For more information about thermal

metrics, see application note AN01

Thermal Characteristics

Junction Temperature

+150

ºC

Internally limited (overtemperature

protection), max. 20000s

Storage Temperature Range

-55

+125

ºC

Humidity

5

85

%

Non condensing

Body Temperature during Soldering

+260

ºC

according to IPC/JEDEC J-STD-020

Moisture Sensitivity Level (MSL)

MSL 1

Represents a max. floor life time of

unlimited