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AS3647B-ZWLT1 Datasheet(PDF) 6 Page - ams AG |
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AS3647B-ZWLT1 Datasheet(HTML) 6 Page - ams AG |
6 / 38 page www.austriamicrosystems.com/AS3647 1.5-4 5 - 37 AS3647/47B Datasheet, Confidential - A b s o l u t e M a x i m u m R a t i n g s 5 Absolute Maximum Ratings Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Table 4, “Electrical Characteristics,” on page 6 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 3. Absolute Maximum Ratings Parameter Min Max Units Comments VIN to GND -0.3 +7.0 V STROBE, TXMASK/TORCH, SCL, SDA to GND -0.3 VIN + 0.3 Vmax. +7V SW1/2/3, VOUT1/2, LED_OUT1/2 to GND -0.3 +7.0 V VOUT1/2 to SW1/2/3 -0.3 V Note: Diode between VOUT1/2 and SW1/2/3 voltage between 2xGND, GNDA pins 0.0 0.0 V short connection recommended Input Pin Current without causing latchup -100 +100 +IIN mA Norm: EIA/JESD78 Continuous Power Dissipation (TA = +70ºC) Continuous power dissipation 1230 mW PT at 70ºC 1 1. Depending on actual PCB layout and PCB used measured on demoboard; for peak power dissipation during flashing see document 'AS3647/47B Thermal Measurements' Continuous power dissipation derating factor 16.7 mW/ºC PDERATE 2 2. PDERATE derating factor changes the total continuous power dissipation (PT) if the ambient temperature is not 70ºC. Therefore for e.g. TAMB=85ºC calculate PT at 85ºC = PT - PDERATE * (85ºC - 70ºC) Electrostatic Discharge ESD HBM pins LED_OUT1/2 3 3. Pins LED_OUT1 connected to LED_OUT2 and capacitor CVOUT connected to VOUT1/2 and GND; both GND pins connected together ±8000 V Norm: JEDEC JESD22-A114F ESD HBM ±2000 V ESD CDM ±500 V Norm: JEDEC JESD 22-C101E ESD MM ±100 V Norm: JEDEC JESD 22-A115-B Temperature Ranges and Storage Conditions Junction to ambient thermal resistance 60 4 4. Measured on AS3647/47B Demoboard. ºC/W For more information about thermal metrics, see application note AN01 Thermal Characteristics Junction Temperature +150 ºC Internally limited (overtemperature protection), max. 20000s Storage Temperature Range -55 +125 ºC Humidity 5 85 % Non condensing Body Temperature during Soldering +260 ºC according to IPC/JEDEC J-STD-020 Moisture Sensitivity Level (MSL) MSL 1 Represents a max. floor life time of unlimited |
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