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AS1121

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

Electrical Parameters

VCC to GND

-0.3

5

V

All other pins to GND

-0.3

V

VSDO, VXERR to GND

-0.3

V

VOUT0 : VOUT15 to GND

-0.3

30

V

Output Current

50

mA

Input Current (latch-up immunity)

-100

100

mA

Norm: JEDEC 78

Electrostatic Discharge

Electrostatic Discharge HBM

+/- 2

kV

Norm: MIL 883 E method 3015

Thermal Information

Junction to ambient thermal resistance

37

°C/W

For more information about thermal metrics, see

application note AN01 Thermal Characteristics.

Temperature Ranges and Storage Conditions

Junction Temperature

+150

ºC

Storage Temperature Range

-55

+150

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body temperature)

specified is in accordance with IPC/JEDEC J-STD-

020“Moisture/Reflow Sensitivity Classification for Non-

Hermetic Solid State Surface Mount Devices”.

The lead finish for Pb-free leaded packages is matte tin

(100% Sn).

Humidity non-condensing

5

85

%

Moisture Sensitive Level

3

Represents a max. floor life time of 168h