© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com

C1002_X7R_SMD • 12/19/2013 11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress

Reference

Test or Inspection Method

TerminalStrength

JIS–C–6429

Appendix1,Note:Forceof1.8kgfor60seconds.

Board Flex

JIS–C–6429

Appendix2,Note:Standardterminationsystem–2.0mm(minimum)forallexcept3mmforC0G.

Flexible termination system – 3.0 mm (minimum).

Solderability

J–STD–002

Magnification50X.Conditions:

a)MethodB,4hours@155°C,dryheat@235°C

b)MethodB@215°Ccategory3

c)MethodD,category3@260°C

Temperature Cycling

JESD22MethodJA–104

1,000Cycles(-55°Cto+125°C).Measurementat24hours+/-2hoursaftertestconclusion.

Biased Humidity

MIL–STD–202Method103

LoadHumidity:1,000hours85°C/85%RHandratedvoltage.Add100Kohmresistor.Measurement

at24hours+/-2hoursaftertestconclusion.

LowVoltHumidity:1,000hours85°C/85%RHand1.5V.Add100Kohmresistor.

Measurementat24hours+/-2hoursaftertestconclusion.

Moisture Resistance

MIL–STD–202Method106 t=24hours/cycle.Steps7aand7bnotrequired.Unpowered.

Measurementat24hours+/-2hoursaftertestconclusion.

ThermalShock

MIL–STD–202Method107 -55°C/+125°C.Note:Numberofcyclesrequired–300,maximumtransfertime–20seconds,dwell

time – 15 minutes. Air – Air.

HighTemperatureLife

MIL–STD–202Method108

/EIA–198

1,000hoursat125°C(85°CforX5R,Z5UandY5V)with2Xratedvoltageapplied.

StorageLife

MIL–STD–202Method108 150°C,0VDCfor1,000hours.

Vibration

MIL–STD–202Method204

5g'sfor20min.,12cycleseachof3orientations.Note:Use8"X5"PCB0.031"thick7secure

pointsononelongsideand2securepointsatcornersofoppositesides.Partsmountedwithin2"

from any secure point. Test from 10 – 2,000 Hz

MechanicalShock

MIL–STD–202Method213 Figure1ofMethod213,ConditionF.

Resistance to Solvents MIL–STD–202Method215 Addaqueouswashchemical,OKEMCleanorequivalent.

Storage & Handling

Ceramicchipcapacitorsshouldbestoredinnormalworkingenvironments.Whilethechipsthemselvesarequiterobustinother

environments,solderabilitywillbedegradedbyexposuretohightemperatures,highhumidity,corrosiveatmospheres,andlongterm

storage.Inaddition,packagingmaterialswillbedegradedbyhightemperature–reelsmaysoftenorwarpandtapepeelforcemay

increase.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40ºCandmaximumstoragehumiditynotexceed70%

relativehumidity.Temperaturefluctuationsshouldbeminimizedtoavoidcondensationonthepartsandatmospheresshouldbefreeof

chlorineandsulfurbearingcompounds.Foroptimizedsolderabilitychipstockshouldbeusedpromptly,preferablywithin1.5yearsof

receipt.