LMP8602, LMP8602Q, LMP8603, LMP8603Q

SNOSB36D – JULY 2009 – REVISED MARCH 2013

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DESCRIPTION (CONTINUED)

The mid-rail offset adjustment pin enables the user to use these devices for bidirectional single supply voltage

current sensing. The output signal is bidirectional and mid-rail referenced when this pin is connected to the

positive supply rail. With the offset pin connected to ground, the output signal is unidirectional and ground-

referenced.

The LMP8602 and LMP8603 are available in a 8–Pin SOIC package and in a 8–Pin VSSOP package.

The LMP8602Q and LMP8603Q incorporate enhanced manufacturing and support processes for the automotive

market, including defect detection methodologies. Reliability qualification is compliant with the requirements and

temperature grades defined in the AEC Q100 standard.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

For input pins only

±4000V

Human Body

For all other pins

±2000V

Machine Model

200V

Charge Device Model

1000V

6.0V

Continuous Input Voltage (

−22V to 60V

Transient (400 ms)

−25V to 65V

Maximum Voltage at A1, A2, OFFSET and OUT Pins

GND -0.3V

Storage Temperature Range

−65°C to 150°C

150°C

Mounting Temperature

Infrared or Convection (20 sec)

235°C

Wave Soldering Lead (10 sec)

260°C

(1)

“Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of

the device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or

other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating

Conditions indicate conditions at which the device is functional and the device should not be beyond such conditions. All voltages are

measured with respect to the ground pin, unless otherwise specified.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Human Body Model per MIL-STD-883, Method 3015.7. Machine Model, per JESD22-A115-A. Field-Induced Charge-Device Model, per

JESD22-C101-C.

(4)

For the VSSOP package, the bare board spacing at the solder pads of the package will be to small for reliable use at higher voltages

(5)

whichever is lower.

2

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Product Folder Links: LMP8602 LMP8602Q LMP8603 LMP8603Q