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HLMP-7000 Datasheet(PDF) 11 Page - Agilent(Hewlett-Packard) |
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HLMP-7000 Datasheet(HTML) 11 Page - Agilent(Hewlett-Packard) |
11 / 12 page 11 (L) Recommended Reflow Soldering Profile and Soldering Pad Pattern for SMT Options Recommended Reflow Soldering Profile. Wait until device has cooled to room temperature before handling. Recommended Soldering Pad Pattern for Gull Wing Leads 11, 12, and 14. Recommended Soldering Pad Pattern for Yoke Leads 21, 22, and 24. Recommended Soldering Pad Pattern for Z-Bend Leads 31, 32, and 34. 3.30 (0.130) 6.60 (0.260) 0.64 (0.025) 1.27 (0.50) 0.45 (0.018) 0.89 (0.035) #27 DRILL 3.73 (0.147) DIA. CLEARANCE HOLE THROUGH PC BOARD DIMENSIONS ARE IN MILLIMETERS (INCHES) 3.30 (0.130) 6.60 (0.260) 1.27 (0.50) 0.45 (0.018) 0.89 (0.035) #27 DRILL 3.73 (0.147) DIA. CLEARANCE HOLE THROUGH PC BOARD DIMENSIONS ARE IN MILLIMETERS (INCHES) 0.89 (0.035) 1.78 (0.070) 3.58 (0.140) 0.45 (0.018) 0.45 (0.018) 0.89 (0.035) 230 10 SEC. MAX. 2-3°C/SEC. 120 SEC. MAX. TIME 183°C 125-170°C 3-4°C/SEC. 60-150 SEC. 3°C/SEC. MAX. 25°C 50°C °C MAX. +5 –0 |
Similar Part No. - HLMP-7000 |
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Similar Description - HLMP-7000 |
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