11

(L) Recommended Reflow Soldering Profile and Soldering Pad Pattern for SMT Options

Recommended Reflow Soldering Profile.

Wait until device has cooled to room

temperature before handling.

Recommended Soldering Pad Pattern for

Gull Wing Leads 11, 12, and 14.

Recommended Soldering Pad Pattern for

Yoke Leads 21, 22, and 24.

Recommended Soldering Pad Pattern for

Z-Bend Leads 31, 32, and 34.

3.30 (0.130)

6.60 (0.260)

0.64 (0.025)

1.27

(0.50)

0.45

(0.018)

0.89

(0.035)

#27 DRILL

3.73 (0.147) DIA.

CLEARANCE HOLE

THROUGH PC BOARD

DIMENSIONS ARE IN

MILLIMETERS (INCHES)

3.30 (0.130)

6.60 (0.260)

1.27

(0.50)

0.45

(0.018)

0.89

(0.035)

#27 DRILL

3.73 (0.147) DIA.

CLEARANCE HOLE

THROUGH PC BOARD

DIMENSIONS ARE IN

MILLIMETERS (INCHES)

0.89

(0.035)

1.78

(0.070)

3.58 (0.140)

0.45

(0.018)

0.45 (0.018)

0.89 (0.035)

230

10 SEC. MAX.

2-3°C/SEC.

120 SEC. MAX.

TIME

183°C

125-170°C

3-4°C/SEC.

60-150

SEC.

3°C/SEC. MAX.

25°C

50°C

°C MAX.

+5

–0