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SMCPD Datasheet(PDF) 3 Page - Central Semiconductor Corp |
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SMCPD Datasheet(HTML) 3 Page - Central Semiconductor Corp |
3 / 3 page Material Composition Specification SMC Case Device average mass. . . . . . . . . . . . . . . . . . . . . . . . . . . . 232.5 mg Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10% www.centra lsemi.com R5 (3-June 2011) Component Material Material Substance CAS No. Substance (%wt) (mg) (%wt) (mg) (ppm) active device doped Si 1.63% 3.8 Si 7440-21-3 1.63% 3.8 16,344 leadframe copper 39.11% 90.92 Cu 7440-50-8 39.11% 90.92 391,054 die attach high temperature solder paste 1.88% 4.36 Pb 7439-92-1 1.73% 4.033 17,346 Sn 7440-31-5 0.09% 0.218 938 Ag 7440-22-4 0.05% 0.109 469 encapsulation* EMC 56.77% 132 silica 7631-86-9 38.61% 89.76 386,065 epoxy resin 29690-82-2 11.35% 26.4 113,548 phenol resin 9003-35-4 5.68% 13.2 56,774 Sb2O3 1309-64-4 0.57% 1.32 5,677 Br 7726-95-6 0.57% 1.32 5,677 EMC GREEN 56.77% 132 silica (fused) 60676-86-0 43.72% 101.64 437,161 epoxy resin 29690-82-2 5.68% 13.2 56,774 phenol resin 9003-35-4 5.51% 12.804 55,071 carbon black 1333-86-4 0.17% 0.396 1,703 metal hydroxide 1309-42-8 1.7% 3.96 17,032 plating** tin/lead process 0.61% 1.42 Sn 7440-31-5 0.49% 1.136 4,886 Pb 7439-92-1 0.12% 0.284 1,222 matte tin 0.61% 1.42 Sn 7440-31-5 0.61% 1.42 6,108 *EMC GREEN molding compound is Halogen-Free. **For Lead Free plating, add suffix “LEAD FREE” to part number. For Tin/Lead plating, add suffix “TIN/LEAD” to part number. No suffix designation allows for the supply of either lead-free or tin/lead plated product depending on availability. Disclaimer The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no guarantee to completeness or accuracy, as some information is derived from data sources outside the company. |
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