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LM340A Datasheet(PDF) 2 Page - Texas Instruments |
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LM340A Datasheet(HTML) 2 Page - Texas Instruments |
2 / 28 page SOT-223 DDPAK/TO-263 LM340-N, LM78xx SNOSBT0J – FEBRUARY 2000 – REVISED DECEMBER 2013 www.ti.com ΔIQ = 1.3 mA over line and load changes. Figure 3. Current Regulator Figure 4. Comparison between SOT-223 and DDPAK/TO-263 Packages Scale 1:1 Connection Diagrams Figure 5. DDPAK/TO-263 Surface-Mount Package Figure 6. 3-Lead SOT-223 Top View Top View See Package Number KTT0003B See Package Number DCY These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) (3) DC Input Voltage 35V Internal Power Dissipation(4) Internally Limited Maximum Junction Temperature 150°C Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering, 10 sec.) TO-3 Package (NDS) 300°C TO-220 Package (NDE), DDPAK/TO-263 Package (KTT) 230°C ESD Susceptibility(5) 2 kV (1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be ensured. For ensured specifications and test conditions see the Electrical Characteristics. (2) Military datasheets are available upon request. At the time of printing, the military datasheet specifications for the LM140K-5.0/883, LM140K-12/883, and LM140K-15/883 complied with the min and max limits for the respective versions of the LM140. The LM140H and LM140K may also be procured as JAN devices on slash sheet JM38510/107. (3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (4) The maximum allowable power dissipation at any ambient temperature is a function of the maximum junction temperature for operation (TJMAX = 125°C or 150°C), the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA). PDMAX = (TJMAX − TA)/θJA. If this dissipation is exceeded, the die temperature will rise above TJMAX and the electrical specifications do not apply. If the die temperature rises above 150°C, the device will go into thermal shutdown. For the TO-3 package (NDS), the junction-to-ambient thermal resistance ( θJA) is 39°C/W. When using a heatsink, θJA is the sum of the 4°C/W junction-to-case thermal resistance (θJC) of the TO-3 package and the case-to-ambient thermal resistance of the heatsink. For the TO-220 package (NDE), θJA is 54°C/W and θJC is 4°C/W. If SOT-223 is used, the junction-to-ambient thermal resistance is 174°C/W and can be reduced by a heatsink (see Applications Hints on heatsinking).If the DDPAK\TO-263 package is used, the thermal resistance can be reduced by increasing the PC board copper area thermally connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJAis 37°C/W; and with 1.6 or more inches of copper area, θJA is 32°C/W. (5) ESD rating is based on the human body model, 100 pF discharged through 1.5 k Ω. Operating Conditions (1) (1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be ensured. For ensured specifications and test conditions see the Electrical Characteristics. 2 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM340-N LM78xx |
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