© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com

T2070_T529 • 12/6/2013

77

KEMET Organic Capacitor (KO-CAP) – T529 Series Small Case Size Substrate Terminal Polymer Tantalum

Time

25ºC to Peak

25

Maximum Ramp Up Rate = 3ºC/seconds

Maximum Ramp Down Rate = 6ºC/seconds

Soldering Process

KEMET’s families of surface mount capacitors are compatible

withwave(singleordual),convection,IR,orvaporphasereflow

techniques. Preheating of these components is recommended

to avoid extreme thermal stress. KEMET's recommended

profileconditionsforconvectionandIRreflowreflecttheprofile

conditions of the IPC/J–STD–020D standard for moisture

sensitivity testing. The devices can safely withstand a maximum

ofthreereflowpassesattheseconditions.

Please note that although the X/7343–43 case size can withstand

wavesoldering,thetallprofile(4.3mmmaximum)dictatescarein

wave process development.

Handsolderingshouldbeperformedwithcareduetothedifficulty

in process control. If performed, care should be taken to avoid

contact of the soldering iron to the molded case. The iron should

be used to heat the solder pad, applying solder between the pad

andthetermination,untilreflowoccurs.Oncereflowoccurs,the

iron should be removed immediately. “Wiping” the edges of a chip

and heating the top surface is not recommended.

Duringtypicalreflowoperations,aslightdarkeningofthegold-

colored epoxy may be observed. This slight darkening is normal

and not harmful to the product. Marking permanency is not

affected by this change.

Profile Feature

SnPb Assembly Pb-Free Assembly

Preheat/Soak

Temperature Minimum (T

100°C

150°C

Temperature Maximum (T

150°C

200°C

Time (t

60 – 120 seconds

60 – 120 seconds

Ramp-up Rate (T

3°C/seconds maximum

3°C/seconds maximum

Liquidous Temperature (T

183°C

217°C

Time Above Liquidous (t

60 – 150 seconds

60 – 150 seconds

Peak Temperature (T

220°C*

235°C**

250°C*

260°C**

Time within 5°C of Maximum

Peak Temperature (t

20 seconds maximum

30 seconds maximum

Ramp-down Rate (T

6°C/seconds maximum

6°C/seconds maximum

Time 25°C to Peak

Temperature

6 minutes maximum

8 minutes maximum

Note: All temperatures refer to the center of the package, measured on the

package body surface that is facing up during assembly reflow.

*Case Size D, E, P, Y, and X

**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z

Construction