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PDTC114ET Datasheet(PDF) 4 Page - NXP Semiconductors |
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PDTC114ET Datasheet(HTML) 4 Page - NXP Semiconductors |
4 / 17 page PDTC114E_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 12 — 21 December 2011 4 of 17 NXP Semiconductors PDTC114E series NPN resistor-equipped transistors; R1 = 10 k , R2 = 10 k 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. [3] Device mounted on an FR4 PCB with 70 m copper strip line, standard footprint. (1) SOT23; FR4 PCB, standard footprint SOT883; FR4 PCB with 70 m copper strip line, standard footprint (2) SOT323; FR4 PCB, standard footprint (3) SOT416; FR4 PCB, standard footprint Fig 1. Power derating curves Tamb (°C) -75 175 125 25 75 -25 006aac778 100 200 300 Ptot (mW) 0 (1) (2) (3) Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-a) thermal resistance from junction to ambient in free air PDTC114EE (SOT416) [1][2] --830 K/W PDTC114EM (SOT883) [2][3] --500 K/W PDTC114ET (SOT23) [1] --500 K/W PDTC114EU (SOT323) [1] --625 K/W |
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