Board Level

Heat Sinks

All other products, please contact factory for price, delivery, and minimums.

Normally stocked

38

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

288 SERIES

Compact Wave-Solderable Low-Cost Heat Sinks

Height Above

Maximum

Thermal Performance at Typical Load

Standard

PC Board

Footprint

Natural

Forced

Weight

P/N

in. (mm)

in. (mm)

Convection

Convection

lbs. (grams)

288-1AB

1.250 (31.8)

0.875 (22.2) x 0.215 (5.5)

85° C @ 4W

12°C/W @ 200 LFM

0.0057 (2.59)

TO-220, TO-202

271 SERIES

Top-Mount Booster Heat Sinks for Use with 270/272/280 Series

TO-220

Horizontal

Height Above

Mounting Footprint

Thermal Performance at Typical Load

Standard

Semiconductor Case

Dimensions

Natural

Forced

Weight

P/N

in. (mm)

in. (mm)

Convection

Convection

lbs. (grams)

271-AB

0.500 (12.7)

1.750 (44.5) x 0.700 (17.8)

62°C @ 4W (NOTE A)

5.1° C/W @ 400 LFM

0.0052 (2.36)

31 °C @ 4W (NOTE B)

1.8° C/W 400 LFM (NOTE B)

Material: Aluminum, Black Anodized

This top-hat style booster heat sink can be added to any of the 270, 272, or 280 Series for

improved performance.

NOTE A: Thermal resistance with one 271-AB. NOTE B: Thermal resistance (total) as shown

with (2) 271-AB types added to (1) 272-AB type.

Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good

electrical connections for vertical mounting of TO-220 and TO-202 semicon-

ductor packages. These heat sinks are designed for use where minimum PC

board space is available. The 288-1AB is a stamped aluminum heat sink, black

anodized, designed for applications requiring good heat dissipation from a heat

sink occupying minimum space, available at minimum cost.

MECHANICAL DIMENSIONS

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

271 SERIES

Dimensions: in. (mm)

MECHANICAL DIMENSIONS

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

288 SERIES

Dimensions: in. (mm)